Datasheet > WW20NR005FTLJ

WW20NR005FTLJ

更新时间： 2024-04-09 18:57:58

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
7页	455K
描述
2010(5025), 0.005Ω, ±1%, 1W

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WW20NR005FTLJ 数据手册

Approval sheet

TEST AND REQUIREMENTS (AEC Q200)

TEST

PROCEDURE

Test 1000 hrs./ @T=125℃/ Un-powered.

REQUIREMENT

High temperature exposure

△ R/R max. ±(1%+0.5mΩ)

MIL-STD-202 Method 108 Measurement at 24±2 hours after test conclusion.

no visible damage

Temperature Cycling

Test 1000 cycles (-55℃ to +125℃).

△ R/R max. ±(0.5%+0.5mΩ)

JESD22 Method JA-104

Measurement at 24±2 hours after test conclusion

no visible damage

Moisture Resistance

Test 65℃/ 80~100%RH/ 10Cycles (t=24hrs/cycle).

△ R/R max. ±(0.5%+0.5mΩ)

MIL-STD-202 Method 106 Measurement at 24±2 hours after test conclusion.

no visible damage

Biased Humidity

MIL-STD-202 Method 103 Measurement at 24±2 hours after test conclusion.

Test 1000 hours/ @85℃/85% RH./ 10% of operation power.

△ R/R max. ±(1%+0.5mΩ)

no visible damage

Operational Life

MIL-STD-202 Method 108 Measurement at 24±2 hours after test conclusion

Test 1000 hrs./ TA=125℃ / 35% of operating power.

△ R/R max. ±(1%+0.5mΩ)

no visible damage

External Visual

MIL-STD-883 Method 2009 workmanship

Electrical test not required. Inspect device construction, marking and

No visual damage and refer

WTC marking code.

Physical Dimensions

JESD22 Method JB-100

The chip dimension (L, W, T, D) prescribed in the detail specification

shall be checked

Within the specified tolerance

Within product specification

tolerance and no visible

damage

Mechanical Shock

MIL-STD-202 Method 213 Velocity:12.3ft/sec.

Test Peak value:100g's / Wave:Hail-sine / Duration:6ms /

Vibration

MIL-STD-202 Method 204

△R/R max. ±(0.5%+0.5mΩ)

no visible damage

Test 5g’s for 20min., 12 cycles each of 3 orientations.

Resistance to Soldering

Heat

MIL-STD-202 Method 210

△ R/R max. ±(0.5%+0.5mΩ)

no visible damage

Solder dipping @ 270℃±5℃ for 10±1sec.

Thermal Shock

Test -55 to 155℃/ dwell time 15min/ Max transfer time 20sec/

△ R/R max. ±(0.5%+0.5mΩ)

MIL-STD-202 Method 107 300cycles.

no visible damage

ESD

AEC-Q200-002

△ R/R max. ±(1%+0.5mΩ)

no visible damage

Test contact 1KV(min)

a) Bake for 155℃ dwell time 4hrs/ solder dipping 235℃/ 5sec.

b) Steam the sample dwell time 8 hour/ solder dipping 215℃/ 5sec.

Solderability

good tinning (>95% covered)

no visible damage

J-STD-002

c) Steam the sample dwell time 8 hour/ solder dipping 260℃/ 7sec.

Natural resistance change per change in degree centigrade.

Temperature Coefficient of

Resistance(T.C.R)

Refer to

“QUICK REFERENCE DATA”

R₂ R

10⁶(ppm/C) t₁: 20°C+5°C-1°C

Clause 4.8

₁t₂t₁

R₁: Resistance at reference temperature

R₂: Resistance at test temperature

Bending 2mm (Min).

Board flex

△ R/R max. ±(0.5%+0.5mΩ)

AEC-Q200-005

Termination strength

AEC-Q200-006

no visible damage

Force: 1.8kg for 60sec.

No cracking or no part being

sheared off from its pad.

Page 6 of 7

ASC_WW20N_J_AUTO_V01

MAR 2017

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