Datasheet > WW10XR027JTL

WW10XR027JTL

更新时间： 2024-04-09 18:55:54

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
7页	216K
描述
1210(3225), 0.027Ω, ±5%, 1/3W

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WW10XR027JTL 数据手册

Approval sheet

CATALOGUE NUMBERS

The resistors have a catalogue number starting with .

WW10

Size code

WW10: 1210

R100

Type code

X : Thick film,

Resistance code – 4 digits

R100 = 0.1 OHM

Tolerance

J: ± 5%

F: ± 1%

Packaging code

Termination code

T: 7” Reeled taping L = Sn base (lead free)

R976 = 0.976 OHM

ꢀ

Reeled tape packaging : 8mm width paper taping 5000pcs per 7” reel.

TEST AND REQUIREMENTS(JIS C 5201-1 : 1998)

Essentially all tests are carried out according to the schedule of IEC publication 115-8, category

LCT/UCT/56(rated temperature range : Lower Category Temperature, Upper Category Temperature; damp

heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.

The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical

robustness testing procedure for electronic components" and under standard atmospheric conditions according

to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :

Temperature: 15°C to 35°C.

Relative humidity: 45% to 75%.

Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).

All soldering tests are performed with midly activated flux.

TEST

PROCEDURE

REQUIREMENT

Refer to

Natural resistance change per change in degree centigrade.

Temperature Coefficient

of Resistance(T.C.R)

“QUICK REFERENCE DATA”

R₂− R

×10⁶(ppm/°C)

t₁: 20°C+5°C-1°C

Clause 4.8

(

t₂− t₁

)

R₁: Resistance at reference temperature

R₂: Resistance at test temperature

Permanent resistance change after a 5second application of a

voltage 2.5 times RCWV or the maximum overload current

specified in the above list, whichever is less.

Short time overload

(S.T.O.L)

Clause 4.13

∆R/R max. ±(2%+0.001Ω)

Resistance to soldering

heat(R.S.H)

Clause 4.18

Un-mounted chips completely immersed for 10±1 second in a

SAC solder bath at 260℃±5ºC

no visible damage

∆ R/R max.±(1%+0.001Ω)

Un-mounted chips completely immersed for 2±0.5 second in a

SAC solder bath at 235℃±5℃

Solderability

Clause 4.17

good tinning (>95% covered)

no visible damage

30 minutes at -55°C±3°C, 2~3 minutes at 20°C+5°C-1°C, 30

minutes at +155°C±3°C, 2~3 minutes at 20°C+5°C-1°C, total 5

continuous cycles

no visible damage

Temperature cycling

Clause 4.19

∆R/R max. ±(1%+0.001Ω)

1000 +48/-0 hours, loaded with RCWV or Vmax in chamber

controller 70±2ºC, 1.5 hours on and 0.5 hours off

Load life (endurance)

Clause 4.25

∆R/R max. ± (5%+0.001Ω)

1000 +48/-0 hours, loaded with RCWV or Vmax in humidity

chamber controller at 40°C±2°C and 90~95% relative

humidity, 1.5hours on and 0.5 hours off

Load life in Humidity

Clause 4.24

Page 5 of 7

ASC_WW10X_V07

Sep.- 2011

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