QFM
Vishay Electro-Films
Thin Film, Top-Contact Resistor
FEATURES
• Wire bondable
Product may not
be to scale
• Small size, 0.020 inches square
• Resistance range: 1.0 Ω to 1 MΩ
• DC power rating: 25 mW
The QFM series tantulum nitride on quartz single-value
resistor chips offer a small size, wide ohmic value range and
excellent frequency response.
• Quartz substrate: < 0.1 pF shunt capacitance
• Resistor material: Tantalum nitride, self passivating
• Moisture resistant
The QFMs tantalum nitride resistor material offers excellent
resistance to high moisture environments.
The QFMs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The QFMs are 100 % electrically tested and
visually inspected to MIL-STD-883.
APPLICATIONS
The QFM top-contact resistor chips are designed to handle substantial power loads in many types of hybrid packages. They are
ideally suited for this purpose because of their small size.
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
1 % 0.2 %
PROCESS CODE
0.1 %
CLASS H*
103
CLASS K*
107
ꢀ2 ppmꢁ/C
20 ppmꢁ/C
100 ppmꢁ/C
101
105
102
106
ꢀ20 ppmꢁ/C
100
104
Aluminum terminations
*MIL-PRF-38534 inspection criteria
1 Ω
10 Ω 30 Ω 100 Ω
ꢀ00 kΩ 430 kΩ 6ꢀ0 kΩ 1 MΩ
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-ꢀ0ꢀ, Method 308
100 Ω - ꢀ20 kΩ
< 100 Ω or > ꢀ21 kΩ
- 35 dB typ.
- 20 dB typ.
Moisture Resistance, MIL-STD-ꢀ0ꢀ, Method 106
Stability, 1000 h, + 1ꢀ2 /C, 1ꢀ2 mW
Operating Temperature Range
0.5 % max. ΔR/R
(0.25 % + 0.01 Ω) max. ΔR/R
- 55 °C to + 125 °C
Thermal Shock, MIL-STD-ꢀ0ꢀ,
Method 107, Test Condition F
0.25 % max. ΔR/R
High Temperature Exposure, + 120 /C, 100 h
Dielectric Voltage Breakdown
0.5 % max. ΔR/R
200 V
Insulation Resistance
1012 min.
Operating Voltage
100 V max.
25 mW
DC Power Rating at + 70 /C (Derated to Zero at + 172 /C)
2 x Rated Power Short-Time Overload, + ꢀ2 /C, 2 s
0.25 % max. ΔR/R
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For technical questions, contact: efi@vishay.com
Document Number: 61078
Revision: 14-Mar-08