Datasheet > WQBD3216HCU500PH

WQBD3216HCU500PH

更新时间： 2024-04-09 18:57:49

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
10页	2202K
描述
SMD Ferrite Chip Bead (AEC-Q200)/ WQBD Series 220, 2A

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数据手册

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WQBD3216HCU500PH 数据手册

Approval Sheet

Test item

Test condition

1. Solder temperature : 235 ± 5℃

2. Flux : Rosin

Criteria

1. More than 95 % of terminal

electrode should be covered with new

solder

Solderability Test

3. DIP time : 5 ± 1 sec

2. No mechanical damage

Epoxy-PCB(1.6mm)

Deflection 2mm(min)

Board Flex

No mechanical damage.

No mechanical damage

60s minimum holding time

Size

Apply Force(F) Test Time

Terminal Strength

1005

1608

≧2012

10 ±1 sec

60 ±1 sec

10 N

17.7 N

LAND PATTERNS FOR REFLOW SOLDERING

SOLDER LAND INFORMATION

Unit: mm (inches)

Size

1005

1608

2012

3216

3225

4516

1.2 ～ 1.4

(0.047 ～ 0.055)

1.8 ～ 2.0

(0.071 ～ 0.079)

3.0 ～ 4.0

(0.118 ～ 0.157)

4.2 ～ 5.2

(0.165 ～ 0.205)

4.2 ～ 5.2

0.4

(0.016)

0.7

(0.028)

1.2

(0.047)

2.0

(0.079)

2.0

0.5

(0.020)

0.7

(0.028)

1.0

(0.039)

1.2

(0.047)

3.4

(0.165 ～ 0.205)

5.5 ～ 6.5

(0.217 ～ 0.256)

(0.079)

3.0

(0.118)

(0.134)

1.2

(0.047)

Page 10 of 10

ASC_ WQBDHC Series

Nov - 2019

1...7 8 910

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