5秒后页面跳转
WEDF1M32B-70H1C5A PDF预览

WEDF1M32B-70H1C5A

更新时间: 2024-02-07 13:14:10
品牌 Logo 应用领域
玛居礼 - MERCURY 内存集成电路
页数 文件大小 规格书
9页 725K
描述
Flash Module,

WEDF1M32B-70H1C5A 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:PGA, PGA66,11X11Reach Compliance Code:compliant
风险等级:5.81最长访问时间:70 ns
其他特性:USER CONFIGURABLE AS 4MX8备用内存宽度:16
启动块:BOTTOM数据保留时间-最小值:20
JESD-30 代码:S-CPGA-P66长度:27.3 mm
内存密度:33554432 bit内存集成电路类型:FLASH MODULE
内存宽度:32功能数量:1
部门数/规模:1,2,1,15端子数量:66
字数:1048576 words字数代码:1000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:1MX32
输出特性:3-STATE封装主体材料:CERAMIC
封装代码:PGA封装等效代码:PGA66,11X11
封装形状:SQUARE封装形式:GRID ARRAY
并行/串行:PARALLEL编程电压:5 V
座面最大高度:4.6 mm部门规模:16K,8K,32K,64K
最大待机电流:0.00002 A最大压摆率:0.2 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:PIN/PEG端子节距:2.54 mm
端子位置:PERPENDICULAR类型:NOR TYPE
宽度:27.3 mmBase Number Matches:1

WEDF1M32B-70H1C5A 数据手册

 浏览型号WEDF1M32B-70H1C5A的Datasheet PDF文件第2页浏览型号WEDF1M32B-70H1C5A的Datasheet PDF文件第3页浏览型号WEDF1M32B-70H1C5A的Datasheet PDF文件第4页浏览型号WEDF1M32B-70H1C5A的Datasheet PDF文件第5页浏览型号WEDF1M32B-70H1C5A的Datasheet PDF文件第6页浏览型号WEDF1M32B-70H1C5A的Datasheet PDF文件第7页 
1Mx32 5V NOR FLASH MODULE  
WEDF1M32B-XXX5  
FEATURES  
 Access Times of 70, 90, 120ns  
 Organized as 1Mx32, user congurable as 2Mx16 or 4Mx8.  
 Commercial, Industrial and Military Temperature Ranges  
 5V ± 10% for Read and Write Operations.  
 Low Power CMOS  
 Packaging:  
• 66 pin, PGA Type, 1.075” square, Hermetic Ceramic HIP  
(Package 400)  
• 68 lead, 22mm Low Prole CQFP, 3.5mm (0.140”),  
(Package 510)  
 Embedded Erase and Program Algorithm  
 Built-in Decoupling Caps and Multiple Ground Pins for Low  
 Sector Architecture  
Noise Operation  
• One 16KByte Sectors  
 Weight  
• Two 8KByte Sectors  
WEDF1M32B-XG2UX5 - 8 grams typical  
WEDF1M32B-XH1X5 - 13 grams typical  
• One 32KByte Sectors  
• Fifteen 64KByte Sectors  
 1,000,000 Erase/Program Cycles  
* This product is under development, is not qualied or characterized and is subject to change or  
cancellation without notice.  
PIN CONFIGURATION FOR WF1M32B-XH1X5  
TOP VIEW  
PIN DESCRIPTION  
I/O0-31  
A0-19  
WE#  
Data Inputs/Outputs  
Address Inputs  
Write Enable  
Chip Selects  
Output Enable  
Reset  
1
12  
23  
34  
45  
56  
I/O  
I/O  
8
RESET#  
I/O15  
I/O14  
I/O13  
I/O12  
OE#  
I/O24  
I/O25  
I/O26  
V
CC  
I/O31  
I/O30  
I/O29  
I/O28  
CS1-4#  
OE#  
9
CS2  
#
CS4#  
I/O10  
GND  
I/O11  
NC  
RESET#  
VCC  
A
A
A
A
A
14  
16  
11  
0
A7  
I/O27  
Power Supply  
Ground  
A
A
A
V
10  
A
12  
NC  
13  
A
A
A
4
5
6
A1  
A2  
A3  
GND  
NC  
Not Connected  
9
A17  
15  
CC  
WE#  
A
18  
I/O  
I/O  
I/O  
I/O  
7
6
5
4
A
8
I/O16  
I/O17  
I/O18  
NC  
CS  
I/O23  
I/O22  
I/O21  
I/O20  
Block Diagram  
I/O  
I/O  
I/O  
0
1
2
CS1  
#
3#  
CS1#  
CS2#  
CS3#  
CS4#  
A19  
GND  
I/O19  
RESET#  
WE#  
OE#  
I/O  
3
A0-19  
11  
22  
33  
44  
55  
66  
1M x 8  
1M x 8  
1M x 8  
1M x 8  
8
8
8
8
I/O16-23  
I/O24-31  
I/O0-7  
I/O8-15  
1
Mercury Corp. - Memory and Storage Solutions • (602) 437-1520 • www.mrcy.com  
4338.06E-0816-ss-WEDF1M32B-XXX5  

与WEDF1M32B-70H1C5A相关器件

型号 品牌 获取价格 描述 数据表
WEDF1M32B-70H1I5A WEDC

获取价格

Flash Module, 1MX32, 70ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WEDF1M32B-70H1M5A MERCURY

获取价格

Flash Module,
WEDF1M32B-70HI5 WEDC

获取价格

Flash Module, 1MX32, 70ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WEDF1M32B-70HM5A WEDC

获取价格

Flash Module, 1MX32, 70ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
WEDF1M32B-90G2TC5 WEDC

获取价格

Flash Module, 1MX32, 90ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68
WEDF1M32B-90G2TC5A WEDC

获取价格

Flash Module, 1MX32, 90ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68
WEDF1M32B-90G2TI5A WEDC

获取价格

Flash Module, 1MX32, 90ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68
WEDF1M32B-90G2TM5 WEDC

获取价格

Flash Module, 1MX32, 90ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68
WEDF1M32B-90G2TM5A WEDC

获取价格

Flash Module, 1MX32, 90ns, CQFP68, 4.60 MM HEIGHT, CERAMIC, QFP-68
WEDF1M32B-90G2UC5A MERCURY

获取价格

Flash Module,