Datasheet > WEDF1M32B-90H1C5A

WEDF1M32B-90H1C5A

更新时间： 2024-01-15 02:07:24

品牌	Logo	应用领域
WEDC		内存集成电路
页数	文件大小	规格书
8页	414K
描述
Flash Module, 1MX32, 90ns, CPGA66, 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66

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WEDF1M32B-XXX5

White Electronic Designs

ADVANCED*

1Mx32 5V Flash Module

FEATURES

Access Times of 70, 90, 120ns

Organized as 1Mx32, user conﬁgurable as 2Mx16

or 4Mx8.

Packaging:

Commercial, Industrial and Military Temperature

Ranges

• 66 pin, PGA Type, 1.075” square, Hermetic

Ceramic HIP (Package 400)

5V ± 10% for Read and Write Operations.

Low Power CMOS

• 68 lead, 22mm Low Proﬁle CQFP, 3.5mm

(0.140”), (Package 510)

Sector Architecture

Embedded Erase and Program Algorithm

• One 16KByte Sectors

• Two 8KByte Sectors

Built-in Decoupling Caps and Multiple Ground Pins

for Low Noise Operation

Weight

• One 32KByte Sectors

• Fifteen 64KByte Sectors

1,000,000 Erase/Program Cycles

WEDF1M32B-XG2UX5 - 8 grams typical

WEDF1M32B-XH1X5 - 13 grams typical

* This product is under development, is not qualiﬁed or characterized and is subject to

change or cancellation without notice.

PIN CONFIGURATION FOR WF1M32B-XH1X5

Top View

PIN DESCRIPTION

I/O0-31

A0-19

WE#

Data Inputs/Outputs

Address Inputs

Write Enable

I/O

RESET#

I/O15

I/O14

I/O13

I/O12

OE#

I/O24

I/O25

I/O26

I/O31

I/O30

I/O29

I/O28

CS1-4#

OE#

Chip Selects

CS4#

Output Enable

I/O10

GND

I/O11

RESET# Reset

V_CC

GND

Power Supply

I/O27

Ground

Not Connected

A17

WE#

Block Diagram

I/O

I/O16

I/O17

I/O18

I/O23

I/O22

I/O21

I/O20

CS1#

CS2#

CS3#

CS4#

RESET#

WE#

I/O

CS1

OE#

A0-19

A19

GND

I/O19

1M x 8

I/O

I/O16-23

I/O24-31

I/O0-7

I/O8-15

White Electronic Designs Corp. reserves the right to change products or speciﬁcations without notice.

May 2007

Rev.2

White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com

12 3 4 5 6 7 8

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