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W77LE58-25 PDF预览

W77LE58-25

更新时间: 2024-01-04 21:01:55
品牌 Logo 应用领域
华邦 - WINBOND 微控制器和处理器光电二极管
页数 文件大小 规格书
81页 648K
描述
8 BIT MICROCONTROLLER

W77LE58-25 技术参数

是否Rohs认证:不符合生命周期:Obsolete
零件包装代码:DIP包装说明:DIP-40
针数:40Reach Compliance Code:unknown
HTS代码:8542.31.00.01风险等级:5.81
Is Samacsys:N具有ADC:NO
地址总线宽度:16位大小:8
CPU系列:8051最大时钟频率:25 MHz
DAC 通道:NODMA 通道:NO
外部数据总线宽度:8JESD-30 代码:R-PDIP-T40
JESD-609代码:e0长度:52.2 mm
I/O 线路数量:32端子数量:40
最高工作温度:70 °C最低工作温度:
PWM 通道:NO封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP40,.6
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:3/5 V
认证状态:Not QualifiedRAM(字节):256
ROM(单词):32768ROM可编程性:FLASH
座面最大高度:5.334 mm速度:25 MHz
子类别:Microcontrollers最大压摆率:50 mA
最大供电电压:5.5 V最小供电电压:2.7 V
标称供电电压:3 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子面层:TIN LEAD端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:15.24 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

W77LE58-25 数据手册

 浏览型号W77LE58-25的Datasheet PDF文件第2页浏览型号W77LE58-25的Datasheet PDF文件第3页浏览型号W77LE58-25的Datasheet PDF文件第4页浏览型号W77LE58-25的Datasheet PDF文件第5页浏览型号W77LE58-25的Datasheet PDF文件第6页浏览型号W77LE58-25的Datasheet PDF文件第7页 
Preliminary W77LE58  
8 BIT MICROCONTROLLER  
Table of Contents--  
GENERAL DESCRIPTION..............................................................................................................................2  
FEATURES......................................................................................................................................................2  
PIN CONFIGURATIONS..................................................................................................................................3  
PIN DESCRIPTION..........................................................................................................................................4  
BLOCK DIAGRAM...........................................................................................................................................6  
FUNCTIONAL DESCRIPTION ........................................................................................................................7  
MEMORY ORGANIZATION.............................................................................................................................8  
Instruction ...................................................................................................................................................28  
InstructiionTiming........................................................................................................................................36  
Power Management ...................................................................................................................................44  
Reset Conditions.........................................................................................................................................46  
Reser State.................................................................................................................................................47  
PROGRAMMABLE TIMERS/COUNTERS....................................................................................................51  
TIMED ACCESS PROTECTION ...................................................................................................................67  
ON-CHIP MTP ROM CHARACTERISTICS...................................................................................................68  
SECURITY BITS............................................................................................................................................70  
ABSOLUTE MAXIMUM RATINGS ................................................................................................................71  
DC ELECTRICAL CHARACTERISTICS ......................................................................................................72  
AC ELECTRICAL CHARACTERISTICS........................................................................................................73  
TYPICAL APPLICATION CIRCUITS .............................................................................................................78  
Expanded External Program Memory and Crystal......................................................................................78  
Expanded External Data Memory and Oscillator ........................................................................................79  
PACKAGE DIMENSIONS..............................................................................................................................79  
40-pin DIP...................................................................................................................................................79  
44-pin PLCC...............................................................................................................................................80  
44-pin QFP .................................................................................................................................................80  
Publication Release Date: August 1999  
- 1 -  
Revision A1  

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