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W19L320STB9L PDF预览

W19L320STB9L

更新时间: 2024-10-28 17:50:07
品牌 Logo 应用领域
华邦 - WINBOND 内存集成电路闪存
页数 文件大小 规格书
52页 1869K
描述
Flash, 2MX16, 90ns, PBGA48, TFBGA-48

W19L320STB9L 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:TFBGA, BGA48,6X8,32针数:48
Reach Compliance Code:compliantECCN代码:3A991.B.1.A
HTS代码:8542.32.00.51风险等级:5.84
最长访问时间:90 ns备用内存宽度:8
启动块:TOP命令用户界面:YES
通用闪存接口:YES数据轮询:YES
JESD-30 代码:R-PBGA-B48JESD-609代码:e1
长度:11 mm内存密度:33554432 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1部门数/规模:8,63
端子数量:48字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:2MX16封装主体材料:PLASTIC/EPOXY
封装代码:TFBGA封装等效代码:BGA48,6X8,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL电源:3.3 V
编程电压:3.3 V认证状态:Not Qualified
就绪/忙碌:YES座面最大高度:1.2 mm
部门规模:8K,64K最大待机电流:0.000005 A
子类别:Flash Memories最大压摆率:0.045 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
切换位:YES类型:NOR TYPE
宽度:8 mmBase Number Matches:1

W19L320STB9L 数据手册

 浏览型号W19L320STB9L的Datasheet PDF文件第2页浏览型号W19L320STB9L的Datasheet PDF文件第3页浏览型号W19L320STB9L的Datasheet PDF文件第4页浏览型号W19L320STB9L的Datasheet PDF文件第5页浏览型号W19L320STB9L的Datasheet PDF文件第6页浏览型号W19L320STB9L的Datasheet PDF文件第7页 
W19B(L)320ST/B Data Sheet  
4M × 8/2M × 16 3V(3.3V) FLASH MEMORY  
Table of Contents-  
1.  
2.  
3.  
4.  
5.  
6.  
GENERAL DESCRIPTION ......................................................................................................... 4  
FEATURES................................................................................................................................. 4  
PIN CONFIGURATIONS ............................................................................................................ 5  
BLOCK DIAGRAM ...................................................................................................................... 5  
PIN DESCRIPTION..................................................................................................................... 5  
FUNCTIONAL DESCRIPTION ................................................................................................... 6  
6.1  
Device Bus Operation..................................................................................................... 6  
6.1.1 Word/Byte Configuration ..................................................................................................6  
6.1.2 Reading Array Data..........................................................................................................6  
6.1.3 Writing Commands/Command Sequences.......................................................................6  
6.1.4 Standby Mode ..................................................................................................................7  
6.1.5 Automatic Sleep Mode .....................................................................................................7  
6.1.6 #RESET: Hardware Reset Pin..........................................................................................7  
6.1.7 Output Disable Mode........................................................................................................8  
6.1.8 Autoselect Mode...............................................................................................................8  
6.1.9 Sector/Sector Block Protection and Unprotection.............................................................8  
6.1.10 Write Protect ( ) .......................................................................................................8  
#WP  
6.1.11 Temporary Sector Unprotect ..........................................................................................9  
6.1.12 Security Sector Flash Memory Region ...........................................................................9  
6.1.13 Hardware Data Protection ............................................................................................10  
Command Definitions ................................................................................................... 10  
6.2.1 Reading Array Data........................................................................................................11  
6.2.2 Reset Command.............................................................................................................11  
6.2.3 Autoselect Command Sequence ....................................................................................11  
6.2.4 Enter Security Sector/Exit Security Sector Command Sequence...................................12  
6.2.5 Byte/Word Program Command Sequence......................................................................12  
6.2.6 Unlock Bypass Command Sequence .............................................................................12  
6.2.7 Chip Erase Command Sequence ...................................................................................13  
6.2.8 Sector Erase Command Sequence ................................................................................13  
6.2.9 Erase Suspend/Erase Resume Commands ...................................................................14  
Write Operation Status ................................................................................................. 14  
6.3.1 DQ7: #Data Polling.........................................................................................................14  
6.3.2 RY/#BY: Ready/#Busy ...................................................................................................15  
6.3.3 DQ6: Toggle Bit I............................................................................................................15  
6.3.4 DQ2: Toggle Bit II...........................................................................................................16  
6.2  
6.3  
Publication Release Date: March 23, 2004  
- 1 -  
Revision A2  

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