VSMY2943SLX01
Vishay Semiconductors
www.vishay.com
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
1000
100
10
100
80
60
40
20
0
IF = 100 mA
tp = 100 μs
1
1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
VF - Forward Voltage (V)
800
850
900
950
1000
1050
λ - Wavelength (nm)
Fig. 5 - Relative Radiant Intensity vs. Wavelength
Fig. 3 - Forward Current vs. Forward Voltage
0°
10°
20°
10
30°
40°
tp = 100 μs
1
0.1
1.0
0.9
50°
60°
0.8
0.7
70°
80°
0.01
1
10
100
1000
0.6 0.4 0.2
0
22688
IF - Forward Current (mA)
Fig. 4 - Relative Radiant Intensity vs. Forward Current
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
SOLDER PROFILE
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
Axis Title
300
250
200
150
100
50
10000
1000
100
Max. 260 °C
245 °C
255 °C
240 °C
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
217 °C
Max. 30 s
Floor life: 4 weeks
Max. 120 s
Max. 100 s
Max. ramp down 6 °C/s
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 2a, acc. to J-STD-020.
Max. ramp up 3 °C/s
DRYING
0
10
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
0
50
100
150
200
250
300
Time (s)
19841
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
Rev. 1.0, 22-Nov-17
Document Number: 84890
3
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000