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VSMY3850_11 PDF预览

VSMY3850_11

更新时间: 2024-11-11 12:20:35
品牌 Logo 应用领域
威世 - VISHAY 二极管
页数 文件大小 规格书
6页 132K
描述
High Speed Infrared Emitting Diode, 850 nm, Surface Emitter Technology

VSMY3850_11 数据手册

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VSMY3850  
Vishay Semiconductors  
www.vishay.com  
High Speed Infrared Emitting Diode, 850 nm,  
Surface Emitter Technology  
FEATURES  
• Package type: surface mount  
• Package form: PLCC-2  
• Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75  
• Peak wavelength: p = 850 nm  
• High reliability  
• High radiant power  
• High radiant intensity  
94 8553  
• Angle of half intensity: = ꢀ0ꢁ  
• Designed for high pulse current operation  
• Floor life: 1ꢀ8 h, MSL 3, acc. J-STD-020  
• Lead (Pb)-free reflow soldering  
• Compliant to RoHS Directive 2002/95/EC and in  
accordance to WEEE 2002/9ꢀ/EC  
DESCRIPTION  
Note  
VSMY3850 is an infrared, 850 nm emitting diode based on  
surface emitter technology with high radiant intensity, high  
optical power and high speed, molded in a PLCC-2 package  
for surface mounting (SMD).  
** Please see document “Vishay Material Category Policy”:  
www.vishay.com/doc?99902  
RELEASED FOR APPLICATIONS  
• IR remote control  
• 3D TV  
PRODUCT SUMMARY  
COMPONENT  
Ie (mW/sr)  
(deg)  
P (nm)  
tr (ns)  
VSMY3850  
17  
ꢀ0  
850  
10  
Note  
Test conditions see table “Basic Characteristics”  
ORDERING INFORMATION  
ORDERING CODE  
VSMY3850-GS08  
VSMY3850-GS18  
PACKAGING  
REMARKS  
PACKAGE FORM  
PLCC-2  
Tape and reel  
Tape and reel  
MOQ: 7500 pcs, 1500 pcs/reel  
MOQ: 8000 pcs, 8000 pcs/reel  
PLCC-2  
Note  
MOQ: minimum order quantity  
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 ꢁC, unless otherwise specified)  
PARAMETER  
TEST CONDITION  
SYMBOL  
VALUE  
UNIT  
Reverse voltage  
VR  
5
V
not designed for DC  
operation  
Forward current  
IF  
mA  
Pulse peak forward current  
Surge forward current  
tp/T = 0.1, tp 100 μs  
IFM  
IFSM  
PV  
800  
mA  
A
tp = 100 μs  
1
200  
Power dissipation  
mW  
ꢁC  
Junction temperature  
Tj  
100  
Operating temperature range  
Storage temperature range  
Soldering temperature  
Tamb  
Tstg  
Tsd  
- 40 to + 85  
- 40 to + 100  
2ꢀ0  
ꢁC  
ꢁC  
acc. figure 7, J-STD-020  
ꢁC  
Thermal resistance junction/ambient  
J-STD-051, soldered on PCB  
RthJA  
250  
K/W  
Rev. 1.1, 31-May-11  
Document Number: 83399  
1
For technical questions, contact: emittertechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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