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UPWLEDLPHCL PDF预览

UPWLEDLPHCL

更新时间: 2024-11-10 07:01:19
品牌 Logo 应用领域
美高森美 - MICROSEMI /
页数 文件大小 规格书
8页 337K
描述
Single Color LED, High Bright White, 1.47mm

UPWLEDLPHCL 数据手册

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P R E L I M I N A R Y  
UPWLEDLPxxx  
HIGH BRIGHTNESS WHITE LED  
P
RODUCT
P
REVIEW  
KEY FEATURES  
ƒ Low profile (0.35mm;15mils)  
ƒ Low Vf available (<3.0V @ 5mA)  
ƒ Color consistent  
The UPWLEDLPxxx product incorporates Microsemi’s unique, patented  
packaging concept to improve the homogeneous distribution of white light. The  
Optomite low profile package has low thermal resistance. The package provides  
a broad luminous emission, typically 120°. The packaging profile lends itself  
to increased life, critical to many white applications.  
ƒ Luminous Efficiency  
ƒ High Brightness  
ƒ Broad angular Emission  
ƒ Rugged Optomite package  
IMPORTANT: For themost current data, consultMICROSEMI’s website: http://www.microsemi.com  
APPLICATIONS  
ABSOLUTE MAXIMUM RATINGS AT 25º C  
ƒ Mobile Phone Keypad  
ƒ Panel, button, switch indicators.  
ƒ Backlighting  
(UNLESS OTHERWISE SPECIFIED)  
Unit  
Parameters  
Symbol  
Value  
ƒ Signage  
DC  
mA  
mA  
°C  
ƒ Signals and Marker Lights  
Forward dc Drive Current  
Peak Forward Current (non-repetitive)  
LED Operating Junction Temperature  
Reverse Voltage  
IF  
IFP  
30  
100  
Tj  
-40 to +140  
8
VR  
PD  
TOPR  
TS  
ESD  
V
Power Dissipation @ 30mA  
Operating Temperature  
125  
mW  
°C  
-40 to +125  
-45 to +140  
1000  
Storage Temperature  
°C  
V
Electrostatic Discharge  
ESD classification  
Class 1  
225  
Solder Reflow Peak Temperature (Solder 10”)  
°C  
THERMAL CHARACTERISTICS  
(UNLESS OTHERWISE SPECIFIED)  
Temperature Rise  
Symbol  
Value  
Units  
Junction Temperature rise at 20ma dc  
TJmx  
15  
°C  
NOTE: The “x x x “trailer in the part number refers to the intensity bin followed by color  
Rank followed by the Vf classification. See Tables, page 2.  
may be used in conjunction with Micorsemi LX1992LED Drivers.  
Anode is the smaller of the two base pads  
Mount to circuit using 60/40 Pb/Sn or equivalent.  
Maximum solder melt exposure temperature is 225°C for 10 seconds.  
Copyright 2002  
Microsemi  
Page 1  
Rev 3 2003-05-23  
580 Pleasant Street, Watertown, MA. 02472-2408, 617-926-0404, Fax: 617-924-1235  

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