Datasheet > 射频和微波 > 射频/微波开关> UPG2008TK-A

UPG2008TK-A

更新时间： 2024-01-16 14:43:08

品牌	Logo	应用领域
日电电子 - NEC		射频和微波开关射频开关微波开关光电二极管
页数	文件大小	规格书
10页	58K
描述
SPDT, 500MHz Min, 2500MHz Max, 0.85dB Insertion Loss-Max, 1.50 X 1.10 MM, 0.55 MM HEIGHT, LEAD LESS, MINIMOLD PACKAGE-6

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技术参数
数据手册

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UPG2008TK-A 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	compliant	风险等级：	5.63
Is Samacsys：	N	构造：	COMPONENT
最大输入功率 (CW)：	28.06 dBm	最大插入损耗：	0.85 dB
JESD-609代码：	e6	最大工作频率：	2500 MHz
最小工作频率：	500 MHz	最高工作温度：	85 °C
最低工作温度：	-45 °C	射频/微波设备类型：	SPDT
端子面层：	Tin/Bismuth (Sn/Bi)	Base Number Matches：	1

UPG2008TK-A 数据手册

µPG2008TB

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions. For soldering

methods and conditions other than those recommended below, contact your nearby sales office.

Soldering Method

Infrared Reflow

Soldering Conditions

Condition Symbol

IR260

Peak temperature (package surface temperature)

Time at peak temperature

: 260°C or below

: 10 seconds or less

: 60 seconds or less

: 120±30 seconds

: 3 times

Time at temperature of 220°C or higher

Preheating time at 120 to 180°C

Maximum number of reflow processes

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

VPS

Peak temperature (package surface temperature)

Time at temperature of 200°C or higher

Preheating time at 120 to 150°C

: 215°C or below

: 25 to 40 seconds

: 30 to 60 seconds

: 3 times

VP215

WS260

HS350

Maximum number of reflow processes

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

Wave Soldering

Partial Heating

Peak temperature (molten solder temperature)

Time at peak temperature

: 260°C or below

: 10 seconds or less

Preheating temperature (package surface temperature) : 120°C or below

Maximum number of flow processes

: 1 time

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

Peak temperature (pin temperature)

: 350°C or below

Soldering time (per side of device)

: 3 seconds or less

: 0.2%(Wt.) or below

Maximum chlorine content of rosin flux (% mass)

Caution Do not use different soldering methods together (except for partial heating).

Data Sheet PG10193EJ01V0DS

1...5 6 789 10

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