5秒后页面跳转
捷配首页

Datasheet > UPD703215YGF-XXX-JBT
UPD703215YGF-XXX-JBT PDF预览

UPD703215YGF-XXX-JBT

更新时间： 2024-02-24 17:05:54
品牌 Logo 应用领域
日电电子 - NEC 微控制器
页数 文件大小 规格书
861页 4423K
描述
32-Bit Single-Chip Microcontrollers

阅读下载

获取价格

UPD703215YGF-XXX-JBT 技术参数

是否Rohs认证： 符合生命周期：Transferred
包装说明：14 X 14 MM, LEAD FREE, PLASTIC, LQFP-100Reach Compliance Code：compliant
风险等级：5.77具有ADC：YES
地址总线宽度：22位大小：32
最大时钟频率：10 MHzDAC 通道：YES
DMA 通道：NO外部数据总线宽度：16
JESD-30 代码：S-PQFP-G100JESD-609代码：e6/e4
长度：14 mmI/O 线路数量：84
端子数量：100最高工作温度：85 °C
最低工作温度：-40 °CPWM 通道：YES
封装主体材料：PLASTIC/EPOXY封装代码：LFQFP
封装形状：SQUARE封装形式：FLATPACK, LOW PROFILE, FINE PITCH
峰值回流温度（摄氏度）：260认证状态：Not Qualified
ROM可编程性：MROM座面最大高度：1.6 mm
速度：20 MHz最大供电电压：5.5 V
最小供电电压：4.5 V标称供电电压：5 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：TIN BISMUTH/NICKEL PALLADIUM GOLD
端子形式：GULL WING端子节距：0.5 mm
端子位置：QUAD处于峰值回流温度下的最长时间：10
宽度：14 mmuPs/uCs/外围集成电路类型：MICROCONTROLLER, RISC
Base Number Matches：1

UPD703215YGF-XXX-JBT 数据手册

 浏览型号UPD703215YGF-XXX-JBT的Datasheet PDF文件第1页浏览型号UPD703215YGF-XXX-JBT的Datasheet PDF文件第2页浏览型号UPD703215YGF-XXX-JBT的Datasheet PDF文件第4页浏览型号UPD703215YGF-XXX-JBT的Datasheet PDF文件第5页浏览型号UPD703215YGF-XXX-JBT的Datasheet PDF文件第6页浏览型号UPD703215YGF-XXX-JBT的Datasheet PDF文件第7页 
NOTES FOR CMOS DEVICES  
VOLTAGE APPLICATION WAVEFORM AT INPUT PIN  
1
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the  
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may  
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,  
and also in the transition period when the input level passes through the area between VIL (MAX) and  
VIH (MIN).  
HANDLING OF UNUSED INPUT PINS  
2
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is  
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS  
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed  
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND  
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must  
be judged separately for each device and according to related specifications governing the device.  
3
PRECAUTION AGAINST ESD  
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and  
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as  
much as possible, and quickly dissipate it when it has occurred. Environmental control must be  
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that  
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static  
container, static shielding bag or conductive material. All test and measurement tools including work  
benches and floors should be grounded. The operator should be grounded using a wrist strap.  
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for  
PW boards with mounted semiconductor devices.  
4
STATUS BEFORE INITIALIZATION  
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power  
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does  
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the  
reset signal is received. A reset operation must be executed immediately after power-on for devices  
with reset functions.  
Purchase of NEC Electronics I2C components conveys a license under the Philips I2C Patent Rights to  
use these components in an I2C system, provided that the system conforms to the I2C Standard  
Specification as defined by Philips.  
Caution: µPD70F3214H, 70F3214HY, 70F3215H, and 70F3215HY use SuperFlashTM technology  
licensed from Silicon Storage Technology, Inc.  
Windows and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in  
the United States and/or other countries.  
PC/AT is a trademark of International Business Machines Corporation.  
SPARCstation is a trademark of SPARC International, Inc.  
Solaris and SunOS are trademarks of Sun Microsystems, Inc.  
SuperFlash is a registered trademark or trademark of Silicon Storage Technology, Inc. in several  
countries including the United States and Japan.  
3
User’s Manual U16890EJ1V0UD  
1234567...861

下载PDF

与UPD703215YGF-XXX-JBT相关器件

型号 品牌 描述 获取价格 数据表
UPD703216 NEC 32-Bit Single-Chip Microcontrollers

获取价格
UPD703216A NEC 32-Bit Single-Chip Microcontrollers

获取价格
UPD703216A1 NEC 32-Bit Single-Chip Microcontrollers

获取价格
UPD703216A2 NEC 32-Bit Single-Chip Microcontrollers

获取价格
UPD703216GJA1-XXX-UEN NEC 32-Bit Single-Chip Microcontrollers

获取价格
UPD703216GJA2-XXX-UEN NEC 32-Bit Single-Chip Microcontrollers

获取价格

与UPD703215YGF-XXX-JBT相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证