UPD17P709GC-3B9

更新时间： 2024-11-14 22:23:11

品牌	Logo	应用领域
日电电子 - NEC		微处理器
页数	文件大小	规格书
38页	200K
描述
4-BIT SINGLE-CHIP MICROCONTROLLER WITH BUILT-IN HARDWARE DEDICATED TO DIGITAL TUNING SYSTEMS

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UPD17P709GC-3B9 数据手册

DATA SHEET

MOS INTEGRATED CIRCUIT

µPD17P709

4-BIT SINGLE-CHIP MICROCONTROLLER WITH

BUILT-IN HARDWARE DEDICATED TO DIGITAL TUNING SYSTEMS

The µPD17P709 is produced by replacing the built-in masked ROM of the µPD17704^Note, µPD17705^Note

µPD17707, µPD17708, and µPD17709 with a one-time PROM.

The µPD17P709 allows programs to be written once, so that the µPD17P709 is suitable for preproduction in

µPD17704, µPD17705, µPD17707, µPD17708, or µPD17709 system development or low-volume production.

When reading this document, also refer to the publications on the µPD17704, µPD17705, µPD17707,

µPD17708, or µPD17709.

Note Under development

The electrical characteristics (including power supply currents) and PLL analog characteristics of

the µPD17P709 differ from those of the µPD17704, µPD17705, µPD17707, µPD17708, and µPD17709. In

high-volume application set production, carefully check those differences.

FEATURES

•

Compatible with the µPD17704, µPD17705, µPD17707, µPD17708, and µPD17709

Built-in one-time PROM

Supply voltage

32K bytes (16384 × 16 bits)

VDD = 5 V ±10%

ORDERING INFORMATION

Part number

Package

µPD17P709GC-3B9

80-pin plastic QFP (14 × 14 mm, 0.65-mm pitch)

The information in this document is subject to change without notice.

Document No. U10142EJ2V0DS00 (2nd edition)

The mark shows major revised points.

Date Published November 1996 P

Printed in Japan

1995

12 3 4 5 6 7...38

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