是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | TSSOP |
包装说明: | HTSSOP, TSSOP24,.25 | 针数: | 24 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.92 |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PDSO-G24 | 长度: | 7.8 mm |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 24 | 最高工作温度: | 70 °C |
最低工作温度: | -20 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HTSSOP | 封装等效代码: | TSSOP24,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 4 V |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.02 mA |
标称供电电压 (Vsup): | 4 V | 表面贴装: | YES |
技术: | BICMOS | 温度等级: | COMMERCIAL |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 4.4 mm | Base Number Matches: | 1 |
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