Datasheet > UCC28714

UCC28714

更新时间： 2022-03-27 23:32:03

品牌	Logo	应用领域
德州仪器 - TI		控制器
页数	文件大小	规格书
30页	1328K
描述
Constant-Voltage, Constant-Current Controller With Primary-Side Regulation

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UCC28714 数据手册

UCC28710, UCC28711

UCC28712, UCC28713

UCC28714, UCC28715

www.ti.com

SLUSB86 –NOVEMBER 2012

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

MIN

TYP

MAX

UNIT

VDD

C_VDD

R_CBC

I_VS

Bias supply operating voltage

VDD bypass capacitor

0.047

µF

Cable-compensation resistance

VS pin current

kΩ

°C

−1

T_J

Operating junction temperature

−40

125

THERMAL INFORMATION

UCC28710

UCC28711

UCC28712

UCC28713

UCC28714

UCC28715

THERMAL METRIC⁽¹⁾

UNITS

7 PINS

141.5

73.8

θ_JA

Junction-to-ambient thermal resistance⁽²⁾

Junction-to-case (top) thermal resistance⁽³⁾

Junction-to-board thermal resistance⁽⁴⁾

θ_JCtop

θ_JB

89.0

°C/W

ψ_JT

ψ_JB

Junction-to-top characterization parameter⁽⁵⁾

Junction-to-board characterization parameter⁽⁶⁾

23.5

88.2

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-

standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5) The junction-to-top characterization parameter, ψ_JT, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).

(6) The junction-to-board characterization parameter, ψ_JB, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining θ_JA, using a procedure described in JESD51-2a (sections 6 and 7).

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