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UCC27423MDREP PDF预览

UCC27423MDREP

更新时间: 2024-01-23 08:46:26
品牌 Logo 应用领域
德州仪器 - TI 驱动器MOSFET驱动器驱动程序和接口接口集成电路光电二极管PC
页数 文件大小 规格书
29页 988K
描述
DUAL 4-A HIGH-SPEED LOW-SIDE MOSFET DRIVER WITH ENABLE

UCC27423MDREP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DIP
包装说明:DIP, DIP8,.3针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1Samacsys Description:UCC27423P, Dual MOSFET Power Driver 4A, Inverting, 4 → 15 V, 8-Pin PDIP
高边驱动器:NO接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代码:R-PDIP-T8JESD-609代码:e4
长度:9.81 mm功能数量:2
端子数量:8最高工作温度:105 °C
最低工作温度:-40 °C输出特性:TOTEM-POLE
最大输出电流:4 A标称输出峰值电流:4 A
输出极性:INVERTED封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP8,.3
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED电源:4.5/15 V
认证状态:Not Qualified座面最大高度:5.08 mm
子类别:MOSFET Drivers最大压摆率:1.35 mA
最大供电电压:15 V最小供电电压:4.5 V
标称供电电压:14 V表面贴装:NO
技术:BICMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED断开时间:0.05 µs
接通时间:0.04 µs宽度:7.62 mm

UCC27423MDREP 数据手册

 浏览型号UCC27423MDREP的Datasheet PDF文件第1页浏览型号UCC27423MDREP的Datasheet PDF文件第2页浏览型号UCC27423MDREP的Datasheet PDF文件第4页浏览型号UCC27423MDREP的Datasheet PDF文件第5页浏览型号UCC27423MDREP的Datasheet PDF文件第6页浏览型号UCC27423MDREP的Datasheet PDF文件第7页 
UCC27424-EP  
UCC27423-EP  
www.ti.com  
SLUS704B FEBRUARY 2007REVISED APRIL 2012  
POWER DISSIPATION RATING TABLE  
POWER RATING  
(mW)  
θJC  
(°C/W)  
θJA  
(°C/W)  
DERATING FACTOR  
ABOVE 70°C (mW/°C)  
PACKAGE  
SUFFIX  
TA = 70°C  
MSOP-8 PowerPAD(1)  
SOIC 8  
DGN  
D
4.7  
42  
50 – 59  
1370(2)  
344 - 655(3)(4)  
17.1(2)  
6.25 - 11.9(3)(4)  
84 - 160  
(1) The PowerPAD package is not directly connected to any leads of the package. However, it is electrically and thermally connected to the  
substrate, which is the ground of the device.  
(2) 150°C operating junction temperature is used for power-rating calculations.  
(3) The range of values indicates the effect of PC board. These values are intended to give the system designer an indication of the best-  
and worst-case conditions. In general, the system designer should attempt to use larger traces on the PC board, where possible, in  
order to spread the heat away from the device more effectively. For information on the PowerPAD package, refer to technical brief,  
PowerPad™ Thermally-Enhanced Package, literature number SLMA002, and application brief, PowerPad™ Made Easy, literature  
number SLMA004.  
(4) 125°C operating junction temperature is used for power-rating calculation.  
Table 1. Inputs/Outputs  
INPUTS (VIN_L, VIN_H)  
OUTPUTS  
ENBA  
ENBB  
INA  
L
INB  
L
OUTA  
OUTB  
H
H
H
H
L
H
H
H
H
L
L
L
L
H
L
L
H
H
L
H
H
L
H
H
H
L
X
X
Copyright © 2007–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): UCC27424-EP UCC27423-EP  

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