Datasheet > TUSB1042IRNQR

TUSB1042IRNQR

更新时间： 2023-09-03 20:34:25

品牌	Logo	应用领域
德州仪器 - TI		开关驱动驱动器
页数	文件大小	规格书
39页	1406K
描述
10Gbps USB Type-C 2:1 线性转接驱动器开关 \| RNQ \| 40 \| -40 to 85

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TUSB1042IRNQR 数据手册

TUSB1042I

www.ti.com.cn

ZHCSGH5D –AUGUST 2017–REVISED MAY 2019

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

MAX

UNIT

Supply Voltage Range⁽²⁾, V_CC

–0.3

Differential voltage between positive and

negative inputs

±2.5

Voltage Range at any input or output pin

Voltage at differential inputs

CMOS Inputs

–0.5

V_CC+ 0.5

125

Maximum junction temperature, T_J

Storage temperature, T_stg

°C

–65

150

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to the GND terminals.

6.2 ESD Ratings

VALUE

UNIT

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾

±5000

V_(ESD)

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

C101⁽²⁾

±1500

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

3.6

UNIT

Main power supply

3.3

V_CC

Supply Ramp Requirement

100

3.6

V_(12C)

V_(PSN)

T_A

Supply that external resistors are pulled up to on SDA and SCL

Supply Noise on V_CCpins

1.7

-40

100

°C

Operating free-air temperature

TUSB1042I

6.4 Thermal Information

TUSB1042I

THERMAL METRIC⁽¹⁾

RNQ (WQFN)

UNIT

40 PINS

37.6

20.7

9.5

R_θJA

Junction-to-ambient thermal resistance

°C/W

R_θJC(top)

R_θJB

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

0.2

ψ_JB

9.4

R_θJC(bot)

2.3

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

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