是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | CGA | 包装说明: | CGA, BGA255,16X16,50 |
针数: | 255 | Reach Compliance Code: | unknown |
ECCN代码: | 3A001.A.2.C | HTS代码: | 8542.31.00.01 |
风险等级: | 5.16 | Is Samacsys: | N |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 75 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-CBGA-X255 |
JESD-609代码: | e0 | 长度: | 21 mm |
低功率模式: | YES | 端子数量: | 255 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | CGA |
封装等效代码: | BGA255,16X16,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 电源: | 2.5,3.3 V |
认证状态: | Not Qualified | 筛选级别: | MIL-PRF-38535 Class Q |
座面最大高度: | 3.84 mm | 速度: | 300 MHz |
子类别: | Microprocessors | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | UNSPECIFIED |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
宽度: | 21 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TSPC603RVGSB/Q6L | ATMEL |
获取价格 |
PowerPC 603e RISC Microprocessor Family PID7t-603e | |
TSPC603RVGSB/Q6LC | ATMEL |
获取价格 |
PowerPC 603e RISC Microprocessor Family PID7t-603e | |
TSPC603RVGSB/Q8L | ATMEL |
获取价格 |
PowerPC 603e RISC Microprocessor Family PID7t-603e | |
TSPC603RVGSB/Q8LC | ATMEL |
获取价格 |
PowerPC 603e RISC Microprocessor Family PID7t-603e | |
TSPC603RVGSB/T10LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RVGSB/T12LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RVGSB/T14LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RVGSB/T6LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RVGSB/T8LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC | |
TSPC603RVGSU/T10LC | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|CERAMIC |