TPSM846C24
ZHCSHH6B –JANUARY 2018–REVISED JANUARY 2019
www.ti.com.cn
目录
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特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information.................................................. 6
6.5 Electrical Characteristics........................................... 6
6.6 Switching Characteristics.......................................... 8
6.7 Typical Characteristics (VIN = 12 V).......................... 9
6.8 Typical Characteristics (VIN = 5 V).......................... 10
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 12
7.4 Device Functional Modes........................................ 20
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Application and Implementation ........................ 21
8.1 Typical Application .................................................. 21
Power Supply Recommendations...................... 24
10 Layout................................................................... 24
10.1 Layout Guidelines ................................................. 24
10.2 Layout Example .................................................... 25
10.3 Package Specifications......................................... 26
10.4 EMI........................................................................ 26
10.5 Mounting and Thermal Profile Recommendation.. 28
11 器件和文档支持 ..................................................... 29
11.1 器件支持................................................................ 29
11.2 接收文档更新通知 ................................................. 29
11.3 社区资源................................................................ 29
11.4 商标....................................................................... 29
11.5 静电放电警告......................................................... 29
11.6 术语表 ................................................................... 29
12 机械、封装和可订购信息....................................... 30
12.1 Tape and Reel Information ................................... 30
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4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision A (August 2018) to Revision B
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Changed HBM ESD from 500 to 1000V................................................................................................................................. 5
Changes from Original (January 2018) to Revision A
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Updated PCB Top-side Layout Recommendation figure ..................................................................................................... 25
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