TPS79301, TPS79318
D
B
V
6
YEQ
D
B
V
5
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
ULTRALOW-NOISE, HIGH PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR
REGULATORS IN NanoStar™ WAFER CHIP SCALE AND SOT23
FEATURES
DESCRIPTION
•
200-mA RF Low-Dropout Regulator
With Enable
The TPS793xx family of low-dropout (LDO)
low-power linear voltage regulators features high
power-supply rejection ratio (PSRR), ultralow-noise,
fast start-up, and excellent line and load transient
responses in NanoStar wafer chip scale and SOT23
packages. NanoStar packaging gives an ultrasmall
footprint as well as an ultralow profile and package
weight, making it ideal for portable applications such
as handsets and PDAs. Each device in the family is
stable, with a small 2.2-µF ceramic capacitor on the
output. The TPS793xx family uses an advanced,
proprietary BiCMOS fabrication process to yield ex-
tremely low dropout voltages (e.g., 112 mV at
200 mA, TPS79330). Each device achieves fast
start-up times (approximately 50 µs with a 0.001-µF
bypass capacitor) while consuming very low quiesc-
ent current (170 µA typical). Moreover, when the
device is placed in standby mode, the supply current
is reduced to less than 1 µA. The TPS79328 exhibits
approximately 32 µVRMS of output voltage noise at
2.8-V output with a 0.1-µF bypass capacitor. Appli-
•
Available in 1.8-V, 2.5-V, 2.8-V, 2.85-V, 3-V,
3.3-V, 4.75-V, and Adjustable (1.22-V to 5.5-V)
•
•
•
•
•
•
High PSRR (70 dB at 10 kHz)
Ultralow-Noise (32 µVRMS, TPS79328)
Fast Start-Up Time (50 µs)
Stable With a 2.2-µF Ceramic Capacitor
Excellent Load/Line Transient Response
Very Low Dropout Voltage (112 mV at Full
Load, TPS79330)
•
5- and 6-Pin SOT23 (DBV) and NanoStar Wafer
Chip Scale (YEQ) Packages
APPLICATIONS
•
•
•
•
•
RF: VCOs, Receivers, ADCs
Audio
Cellular and Cordless Telephones
Bluetooth™, Wireless LAN
Handheld Organizers, PDAs
cations with analog components
that
are
noise-sensitive, such as portable RF electronics,
benefit from the high PSRR and low-noise features
as well as the fast response time.
DBV PACKAGE
(TOP VIEW)
TPS79328
TPS79328
OUT
NR
IN
1
2
5
RIPPLE REJECTION
vs
OUTPUT SPECTRAL NOISE DENSITY
vs
GND
FREQUENCY
FREQUENCY
0.30
3
4
100
90
EN
V
= 3.8 V
= 2.2 µF
IN
I
= 200 mA
OUT
Fixed Option
C
C
OUT
= 0.1 µF
0.25
0.20
80
NR
DBV PACKAGE
(TOP VIEW)
70
IN
GND
EN
OUT
FB
1
2
6
5
60
0.15
50
40
30
I
= 1 mA
OUT
I
= 10 mA
OUT
3
4
NR
0.10
0.05
I
= 200 mA
Adjustable Option
YEQ
OUT
20
10
0
V
C
C
= 3.8 V
= 10 µF
IN
PACKAGE
(TOP VIEW)
OUT
= 0.01 µF
NR
0
IN
OUT
100
1 k
10 k
100 k
10
100
1 k
10 k 100 k 1 M 10 M
C3 C1
B2
A3 A1
Frequency (Hz)
Frequency (Hz)
NR
GND
EN
Figure 1.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth Sig, Inc.
NanoStar is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains PRO-
DUCTION DATA information current as of publication date. Prod-
ucts conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
Copyright © 2001–2004, Texas Instruments Incorporated