是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | HVQCCN, | 针数: | 40 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
Factory Lead Time: | 1 week | 风险等级: | 5.76 |
具有ADC: | YES | 其他特性: | ALSO OPERATES AT 1.8V SUPPLY AT 6 MHZ |
地址总线宽度: | 位大小: | 16 | |
最大时钟频率: | 0.032 MHz | DAC 通道: | NO |
DMA 通道: | NO | 外部数据总线宽度: | |
JESD-30 代码: | S-PQCC-N40 | JESD-609代码: | e4 |
长度: | 5 mm | 湿度敏感等级: | 2 |
DMA 通道数量: | I/O 线路数量: | 13 | |
端子数量: | 40 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | NO |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVQCCN |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
ROM可编程性: | FLASH | 速度: | 16 MHz |
最大供电电压: | 3.6 V | 最小供电电压: | 3 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | NO LEAD |
端子节距: | 0.4 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 5 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC | Base Number Matches: | 1 |
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TPS658600A | TI | Advanced Power Management Unit |
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TPS658600AZQZR | TI | Advanced Power Management Unit |
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TPS658600AZQZT | TI | Advanced Power Management Unit |
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TPS658600ZQZR | TI | Advanced Power Management Unit |
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