是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, | 针数: | 25 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
Factory Lead Time: | 16 weeks | 风险等级: | 1.22 |
Samacsys Confidence: | Samacsys Status: | Released | |
Samacsys PartID: | 607974 | Samacsys Pin Count: | 25 |
Samacsys Part Category: | Integrated Circuit | Samacsys Package Category: | Other |
Samacsys Footprint Name: | BGA25C40P5X5_208X208X63 | Samacsys Released Date: | 2017-01-12 12:59:53 |
Is Samacsys: | N | JESD-30 代码: | S-XBGA-B25 |
JESD-609代码: | e1 | 长度: | 2.2 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 25 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | VFBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 0.625 mm |
标称供电电压: | 3.6 V | 表面贴装: | YES |
电信集成电路类型: | TELECOM CIRCUIT | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.4 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 2.2 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TPS65720YFFR | TI |
完全替代 |
PMU for Bluetooth Headsets | |
TPS65721RSNT | TI |
类似代替 |
PMU for Bluetooth Headsets | |
TPS65721RSNR | TI |
类似代替 |
PMU for Bluetooth Headsets |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TPS65721 | TI |
获取价格 |
PMU for Bluetooth Headsets | |
TPS65721RSNR | TI |
获取价格 |
PMU for Bluetooth Headsets | |
TPS65721RSNT | TI |
获取价格 |
PMU for Bluetooth Headsets | |
TPS65735 | TI |
获取价格 |
PMU For Active Shutter 3D Glasses | |
TPS65735_16 | TI |
获取价格 |
PMU for Active Shutter 3D Glasses | |
TPS65735RSNR | TI |
获取价格 |
PMU For Active Shutter 3D Glasses | |
TPS65735RSNT | TI |
获取价格 |
PMU For Active Shutter 3D Glasses | |
TPS65800 | TI |
获取价格 |
INTEGRATED SINGLE-CELL LITHIUM-ION BATTERY-AND POWER-MANAGEMENT IC | |
TPS65800_07 | TI |
获取价格 |
SINGLE-CELL Li-ION BATTERY- AND POWER-MANAGEMENT IC | |
TPS65800RTQ | TI |
获取价格 |
SINGLE-CELL Li-ION BATTERY- AND POWER-MANAGEMENT IC |