TPS56121
www.ti.com
SLUSAH4 –MARCH 2011
4.5-V to 14-V Input High-Current Synchronous Buck Converter
Check for Samples: TPS56121
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FEATURES
DESCRIPTION
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4.5-V to 14-V Input Voltage Range
Incorporates Power Block Technology
Up to 15-A Output Current
TPS56121 is
a high-efficiency and high-current
synchronous buck converter designed to operate
from a supply between 4.5 V and 14 V. The device is
capable of producing an output voltage as low as
0.6 V at loads up to 15 A. Integrated NexFET™
Power MOSFETs provide a small foot print and ease
of use.
Fixed Frequency Options of 300 kHz, 500 kHz
and 1 MHz
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High-Side and Low-Side MOSFET RDS(on)
Sensing
The device implements a voltage-mode control with
voltage feed-forward compensation that responds
instantly to input voltage change.
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Programmable Soft-Start
600-mV Reference Voltage with 1% Accuracy
Voltage Mode Control with Feed-Forward
Supports Pre-Biased Output
TPS56121 is available in a thermally enhanced
22-pin PQFN (DQP) PowerPAD™ package.
Thermal Shutdown
The device offers design flexibility with a variety of
user programmable functions, including soft-start,
overcurrent protection (OCP) levels, and loop
compensation. OCP levels are programmed by a
single external resistor connected from the ILIM pin to
the circuit ground. During the initial power-on
sequence, the device enters a calibration cycle,
measures the voltage at the ILIM pin, and sets an
internal OCP voltage level. During operation, the
programmed OCP voltage level is compared to the
voltage drop across the low-side FET when it is on to
determine whether there is an overcurrent condition.
It then enters a shutdown/restart cycle until the fault
is removed.
22-Pin 5 mm x 6 mm PQFN PowerPAD™
Package
APPLICATIONS
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Point-of-Load (POL) Power Modules
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High Density DC-DC Converters for Telecom
and Networking Applications
SIMPLIFIED APPLICATION
TPS56121
VOUT
FB
VIN
BOOT
SW
VIN
COMP
PGD
EN/SS
VDD
VOUT
ILIM
BP
VIN
SD
GND
UDG-11047
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD, NexFET are trademarks of Texas Instruments.
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PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated