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TPN6R303NC PDF预览

TPN6R303NC

更新时间: 2024-01-03 18:39:32
品牌 Logo 应用领域
东芝 - TOSHIBA 开关光电二极管晶体管
页数 文件大小 规格书
9页 233K
描述
TRANSISTOR SMALL SIGNAL, FET, FET General Purpose Small Signal

TPN6R303NC 技术参数

生命周期:Active包装说明:SMALL OUTLINE, S-PDSO-F5
Reach Compliance Code:unknown风险等级:5.69
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):43 A
最大漏源导通电阻:0.0084 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-F5元件数量:1
端子数量:5工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE极性/信道类型:N-CHANNEL
表面贴装:YES端子形式:FLAT
端子位置:DUAL晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

TPN6R303NC 数据手册

 浏览型号TPN6R303NC的Datasheet PDF文件第2页浏览型号TPN6R303NC的Datasheet PDF文件第3页浏览型号TPN6R303NC的Datasheet PDF文件第4页浏览型号TPN6R303NC的Datasheet PDF文件第5页浏览型号TPN6R303NC的Datasheet PDF文件第6页浏览型号TPN6R303NC的Datasheet PDF文件第7页 
TPN6R303NC  
MOSFETs Silicon N-channel MOS (U-MOS)  
TPN6R303NC  
1. Applications  
Lithium-Ion Secondary Batteries  
Power Management Switches  
2. Features  
(1) Small, thin package  
(2) Low drain-source on-resistance: RDS(ON) = 5.2 m(typ.) (VGS = 10 V)  
(3) Low leakage current: IDSS = 10 µA (max) (VDS = 30 V)  
(4) Enhancement mode: Vth = 1.3 to 2.3 V (VDS = 10 V, ID = 0.2 mA)  
3. Packaging and Internal Circuit  
1, 2, 3: Source  
4: Gate  
5, 6, 7, 8: Drain  
TSON Advance  
4. Absolute Maximum Ratings (Note) (Ta = 25unless otherwise specified)  
Characteristics  
Symbol  
Rating  
Unit  
V
Drain-source voltage  
Gate-source voltage  
Drain current (DC)  
Drain current (DC)  
Drain current (pulsed)  
Power dissipation  
Power dissipation  
Power dissipation  
VDSS  
VGSS  
ID  
30  
±20  
43  
(Silicon limit)  
(Note 1)  
(Note 1)  
(Note 1)  
A
ID  
20  
(1 ms)  
(Tc = 25)  
(t = 10 s)  
(t = 10 s)  
IDP  
PD  
107  
19  
W
(Note 2)  
(Note 3)  
(Note 4)  
PD  
1.9  
PD  
0.7  
Single-pulse avalanche energy  
Avalanche current  
EAS  
IAR  
Tch  
Tstg  
51  
mJ  
A
20  
Channel temperature  
Storage temperature  
150  
-55 to 150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
2012-09-28  
Rev.1.0  
1

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