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TPL7407LAQPWRQ1 PDF预览

TPL7407LAQPWRQ1

更新时间: 2024-02-24 18:54:54
品牌 Logo 应用领域
德州仪器 - TI 驱动光电二极管接口集成电路驱动器
页数 文件大小 规格书
22页 838K
描述
30V、7 通道汽车类 NMOS 阵列低侧驱动器 | PW | 16 | -40 to 125

TPL7407LAQPWRQ1 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:TSSOP,
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:1.69内置保护:TRANSIENT
驱动器位数:7接口集成电路类型:BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 代码:R-PDSO-G16长度:5 mm
湿度敏感等级:2功能数量:7
端子数量:16最高工作温度:125 °C
最低工作温度:-40 °C输出电流流向:SINK
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260筛选级别:AEC-Q100
座面最大高度:1.2 mm表面贴装:YES
温度等级:AUTOMOTIVE端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:4.4 mm
Base Number Matches:1

TPL7407LAQPWRQ1 数据手册

 浏览型号TPL7407LAQPWRQ1的Datasheet PDF文件第1页浏览型号TPL7407LAQPWRQ1的Datasheet PDF文件第2页浏览型号TPL7407LAQPWRQ1的Datasheet PDF文件第3页浏览型号TPL7407LAQPWRQ1的Datasheet PDF文件第5页浏览型号TPL7407LAQPWRQ1的Datasheet PDF文件第6页浏览型号TPL7407LAQPWRQ1的Datasheet PDF文件第7页 
TPL7407LA-Q1  
ZHCSIA6 MAY 2018  
www.ti.com.cn  
6 Specifications  
6.1 Absolute Maximum Ratings  
at 25°C free-air temperature (unless otherwise noted)  
(1)  
MIN  
–0.3  
–0.3  
–0.3  
–0.3  
MAX  
32  
UNIT  
V
VOUT  
VOK  
VCOM  
VIN  
Pins OUT1-OUT7 to GND voltage  
Output clamp diode reverse voltage(2)  
COM pin voltage(2)  
32  
V
32  
V
(2)  
Pins IN1-IN7 to GND voltage  
30  
V
IDS  
Continuous drain current per channel(3) (4)  
600  
500  
–2  
mA  
mA  
A
IOK  
Output clamp current  
IGND  
TJ  
Total continuous GND-pin current  
Operating virtual junction temperature  
Storage temperature  
–40  
–65  
150  
150  
°C  
°C  
Tstg  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to the GND/substrate pin, unless otherwise noted.  
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient  
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
6.2 ESD Ratings  
VALUE  
±2000  
±500  
UNIT  
Human-body model (HBM), per AEC Q100-002(1)  
V(ESD)  
Electrostatic discharge  
All pins  
Corner pins (1, 8, 9, 16)  
V
Charged-device model (CDM), per AEC  
Q100-011  
±750  
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.  
6.3 Recommended Operating Conditions  
Over operating temperature range  
MIN  
0
MAX  
UNIT  
V
VOUT  
VCOM  
VIL  
OUT1 – OUT7 pin voltage for recommended operation  
COM pin voltage range for full output drive  
IN1- IN7 input low voltage ("Off" high impedance output)  
IN1- IN7 input high voltage ("Full Drive" low impedance output)  
Operating free-air temperature  
30  
30  
6.5  
V
0.9  
V
VIH  
1.5  
–40  
0
V
TA  
125  
500  
°C  
mA  
IDS  
Continuous drain current  
6.4 Thermal Information  
TPL7407LA-Q1  
THERMAL METRIC(1)  
TSSOP (PW)  
UNIT  
16 PINS  
113.1  
46.5  
58.6  
7
θJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
θJCtop  
θJB  
Junction-to-board thermal resistance  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
ψJB  
58  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
4
Copyright © 2018, Texas Instruments Incorporated  

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