TMUX1109
SCDS406 –DECEMBER 2018
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
(2) (3)
MIN
–0.5
–0.5
–3.0
–0.5
–30
MAX
UNIT
V
VDD–VSS
6
VDD
Supply voltage
6
0.3
V
VSS
V
VSEL or VEN
ISEL or IEN
VS or VD
IS or ID (CONT)
Tstg
Logic control input pin voltage (EN, A0, A1)
Logic control input pin current (EN, A0, A1)
Source or drain voltage (Sx, Dx)
Source or drain continuous current (Sx, Dx)
Storage temperature
6
V
30
mA
V
–0.5
–30
VDD+0.5
30
mA
°C
°C
–65
150
TJ
Junction temperature
150
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3) All voltages are with respect to ground, unless otherwise specified.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per
±2000
ANSI/ESDA/JEDEC JS-001, all pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.08
-2.75
1.08
VSS
NOM
MAX
5.5
0
UNIT
VDD
VSS
Positive power supply voltage (single)
Negative power supply voltage (dual)
V
V
V
V
VDD - VSS Supply rail voltage difference
5.5
VDD
VS or VD
Signal path input/output voltage (source or drain pin) (Sx, Dx)
VSEL or
VEN
Logic control input pin voltage
Ambient temperature
0
5.5
V
TA
–40
125
°C
6.4 Thermal Information
TMUX1109
THERMAL METRIC(1)
PW (TSSOP)
16 PINS
118.9
49.3
RSV (QFN)
16 PINS
134.6
74.3
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
65.2
62.8
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
7.6
4.3
ΨJB
64.6
61.1
RθJC(bot)
N/A
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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