TMUX1104
ZHCSIT9B –NOVEMBER 2018–REVISED JULY 2019
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目录
7.10 Bandwidth ............................................................. 20
Detailed Description ............................................ 21
8.1 Functional Block Diagram ....................................... 21
8.2 Feature Description................................................. 21
8.3 Device Functional Modes........................................ 23
8.4 Truth Tables............................................................ 23
Application and Implementation ........................ 24
9.1 Application Information............................................ 24
9.2 Typical Application ................................................. 24
9.3 Design Requirements.............................................. 24
9.4 Detailed Design Procedure ..................................... 25
9.5 Application Curve.................................................... 25
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特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics (VDD = 5 V ±10 %)............ 5
6.6 Electrical Characteristics (VDD = 3.3 V ±10 %)......... 7
6.7 Electrical Characteristics (VDD = 1.8 V ±10 %)......... 9
6.8 Electrical Characteristics (VDD = 1.2 V ±10 %)....... 11
6.9 Typical Characteristics............................................ 13
Parameter Measurement Information ................ 16
7.1 On-Resistance ........................................................ 16
7.2 Off-Leakage Current ............................................... 16
7.3 On-Leakage Current ............................................... 17
7.4 Transition Time ....................................................... 17
7.5 Break-Before-Make................................................. 18
7.6 tON(EN) and tOFF(EN).................................................. 18
7.7 Charge Injection...................................................... 19
7.8 Off Isolation............................................................. 19
7.9 Crosstalk ................................................................. 20
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10 Power Supply Recommendations ..................... 25
11 Layout................................................................... 26
11.1 Layout Guidelines ................................................. 26
11.2 Layout Example .................................................... 26
12 器件和文档支持 ..................................................... 27
12.1 文档支持................................................................ 27
12.2 接收文档更新通知 ................................................. 27
12.3 社区资源................................................................ 27
12.4 商标....................................................................... 27
12.5 静电放电警告......................................................... 27
12.6 Glossary................................................................ 27
13 机械、封装和可订购信息....................................... 27
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4 修订历史记录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision A (December 2018) to Revision B
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删除了器件信息 表中 DQA 封装的产品预览 说明................................................................................................................... 1
Deleted the Product Preview note from the DQA package in the Pin Configuration and Functions section ......................... 3
Added DQA (USON) thermal values to Thermal Information ................................................................................................ 4
Changes from Original (November 2018) to Revision A
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将文件状态从预告信息 更改为生产组合 数据 ......................................................................................................................... 1
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