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TMS3C6416DGLZA5E0 PDF预览

TMS3C6416DGLZA5E0

更新时间: 2024-11-14 04:27:55
品牌 Logo 应用领域
德州仪器 - TI 数字信号处理器
页数 文件大小 规格书
139页 2035K
描述
FIXED-POINT DIGITAL SIGNAL PROCESSORS

TMS3C6416DGLZA5E0 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:FBGA,针数:532
Reach Compliance Code:unknownECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.84
地址总线宽度:23桶式移位器:NO
边界扫描:YES最大时钟频率:75 MHz
外部数据总线宽度:64格式:FIXED POINT
内部总线架构:MULTIPLEJESD-30 代码:S-PBGA-B532
长度:23 mm低功率模式:YES
端子数量:532最高工作温度:105 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:FBGA封装形状:SQUARE
封装形式:GRID ARRAY, FINE PITCH认证状态:Not Qualified
座面最大高度:3.3 mm最大供电电压:1.31 V
最小供电电压:1.19 V标称供电电压:1.25 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
宽度:23 mmuPs/uCs/外围集成电路类型:DIGITAL SIGNAL PROCESSOR, OTHER
Base Number Matches:1

TMS3C6416DGLZA5E0 数据手册

 浏览型号TMS3C6416DGLZA5E0的Datasheet PDF文件第2页浏览型号TMS3C6416DGLZA5E0的Datasheet PDF文件第3页浏览型号TMS3C6416DGLZA5E0的Datasheet PDF文件第4页浏览型号TMS3C6416DGLZA5E0的Datasheet PDF文件第5页浏览型号TMS3C6416DGLZA5E0的Datasheet PDF文件第6页浏览型号TMS3C6416DGLZA5E0的Datasheet PDF文件第7页 
ꢀ ꢁꢂ ꢃ ꢄ ꢅ ꢆꢇ ꢈ ꢉꢈ ꢊ ꢀ ꢁꢂ ꢃ ꢄ ꢅ ꢆꢇ ꢈ ꢉꢋ ꢊ ꢀ ꢁꢂ ꢃꢄ ꢅꢆ ꢇꢈ ꢉꢇ  
ꢌ ꢍꢎ ꢏꢐꢑꢒꢓ ꢍ ꢔꢀ ꢐꢍ ꢕꢍ ꢀꢖꢗ ꢂꢍ ꢕ ꢔꢖꢗ ꢒꢘ ꢓ ꢆꢏ ꢂ ꢂꢓ ꢘ ꢂ  
SPRS146L − FEBRUARY 2001 − REVISED JULY 2004  
Highest-Performance Fixed-Point Digital  
Signal Processors (DSPs)  
Two External Memory Interfaces (EMIFs)  
− One 64-Bit (EMIFA), One 16-Bit (EMIFB)  
− Glueless Interface to Asynchronous  
Memories (SRAM and EPROM) and  
Synchronous Memories (SDRAM,  
SBSRAM, ZBT SRAM, and FIFO)  
− 1280M-Byte Total Addressable External  
Memory Space  
− 2-, 1.67-, 1.39-ns Instruction Cycle Time  
− 500-, 600-, 720-MHz Clock Rate  
− Eight 32-Bit Instructions/Cycle  
− Twenty-Eight Operations/Cycle  
− 4000, 4800, 5760 MIPS  
− Fully Software-Compatible With C62x  
− C6414/15/16 Devices Pin-Compatible  
Enhanced Direct-Memory-Access (EDMA)  
Controller (64 Independent Channels)  
VelociTI.2Extensions to VelociTI  
Advanced Very-Long-Instruction-Word  
(VLIW) TMS320C64xDSP Core  
− Eight Highly Independent Functional  
Units With VelociTI.2Extensions:  
− Six ALUs (32-/40-Bit), Each Supports  
Single 32-Bit, Dual 16-Bit, or Quad  
8-Bit Arithmetic per Clock Cycle  
− Two Multipliers Support  
Host-Port Interface (HPI)  
− User-Configurable Bus Width (32-/16-Bit)  
32-Bit/33-MHz, 3.3-V PCI Master/Slave  
Interface Conforms to PCI Specification 2.2  
[C6415/C6416 ]  
− Three PCI Bus Address Registers:  
Prefetchable Memory  
Non-Prefetchable Memory I/O  
− Four-Wire Serial EEPROM Interface  
− PCI Interrupt Request Under DSP  
Program Control  
Four 16 x 16-Bit Multiplies  
(32-Bit Results) per Clock Cycle or  
Eight 8 x 8-Bit Multiplies  
(16-Bit Results) per Clock Cycle  
− Non-Aligned Load-Store Architecture  
− 64 32-Bit General-Purpose Registers  
− Instruction Packing Reduces Code Size  
− All Instructions Conditional  
− DSP Interrupt Via PCI I/O Cycle  
Three Multichannel Buffered Serial Ports  
− Direct Interface to T1/E1, MVIP, SCSA  
Framers  
− Up to 256 Channels Each  
Instruction Set Features  
− Byte-Addressable (8-/16-/32-/64-Bit Data)  
− 8-Bit Overflow Protection  
− Bit-Field Extract, Set, Clear  
− Normalization, Saturation, Bit-Counting  
− VelociTI.2Increased Orthogonality  
Viterbi Decoder Coprocessor (VCP) [C6416]  
− Supports Over 600 7.95-Kbps AMR  
− Programmable Code Parameters  
− ST-Bus-Switching-, AC97-Compatible  
− Serial Peripheral Interface (SPI)  
Compatible (Motorola)  
Three 32-Bit General-Purpose Timers  
Universal Test and Operations PHY  
Interface for ATM (UTOPIA) [C6415/C6416]  
− UTOPIA Level 2 Slave ATM Controller  
− 8-Bit Transmit and Receive Operations  
up to 50 MHz per Direction  
Turbo Decoder Coprocessor (TCP) [C6416]  
− Supports up to 7 2-Mbps or  
43 384-Kbps 3GPP (6 Iterations)  
− Programmable Turbo Code and  
Decoding Parameters  
− User-Defined Cell Format up to 64 Bytes  
Sixteen General-Purpose I/O (GPIO) Pins  
Flexible PLL Clock Generator  
IEEE-1149.1 (JTAG )  
L1/L2 Memory Architecture  
− 128K-Bit (16K-Byte) L1P Program Cache  
(Direct Mapped)  
− 128K-Bit (16K-Byte) L1D Data Cache  
(2-Way Set-Associative)  
− 8M-Bit (1024K-Byte) L2 Unified Mapped  
RAM/Cache (Flexible Allocation)  
Boundary-Scan-Compatible  
532-Pin Ball Grid Array (BGA) Package  
(GLZ and ZLZ Suffix), 0.8-mm Ball Pitch  
0.13-µm/6-Level Cu Metal Process (CMOS)  
3.3-V I/Os, 1.2-V/1.25-V Internal (500 MHz)  
3.3-V I/Os, 1.4-V Internal (600 and 720 MHz)  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
C62x, VelociTI.2, VelociTI, and TMS320C64x are trademarks of Texas Instruments.  
Motorola is a trademark of Motorola, Inc.  
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.  
ꢝꢥ ꢜꢡ ꢨ ꢡ ꢩ ꢝꢧ ꢠꢡ ꢢ ꢣꢪ ꢀꢙ ꢡ ꢛ ꢣ ꢤ ꢣꢟꢛ ꢝꢥ ꢡꢤ ꢞ ꢙ ꢜꢡ ꢨꢚꢞ ꢡ ꢚꢛ ꢚꢢꢜ ꢚꢞꢤ ꢣꢡ ꢜ ꢝꢢ ꢣꢙ ꢡ ꢧꢤ ꢫꢡꢬ ꢛꢭ  
Copyright 2004 Texas Instruments Incorporated  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  
 

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