Datasheet > 微控制器和处理器 > 串行 IO/通信控制器> TMPN3150B1AFG

TMPN3150B1AFG

更新时间： 2024-11-18 08:42:11

品牌	Logo	应用领域
东芝 - TOSHIBA		/
页数	文件大小	规格书
10页	199K
描述
TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

TMPN3150B1AFG 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
零件包装代码：	QFP	包装说明：	14 X 14 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, QFP-64
针数：	64	Reach Compliance Code：	unknown
风险等级：	5.8	地址总线宽度：	16
边界扫描：	NO	最大时钟频率：	10 MHz
外部数据总线宽度：	8	JESD-30 代码：	S-PQFP-G64
长度：	14 mm	低功率模式：	YES
串行 I/O 数：	1	端子数量：	64
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	QFP
封装形状：	SQUARE	封装形式：	FLATPACK
认证状态：	Not Qualified	座面最大高度：	3.15 mm
最大供电电压：	5.5 V	最小供电电压：	4.5 V
标称供电电压：	5 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子形式：	GULL WING	端子节距：	0.8 mm
端子位置：	QUAD	宽度：	14 mm
uPs/uCs/外围集成电路类型：	SERIAL IO/COMMUNICATION CONTROLLER, LAN

TMPN3150B1AFG 数据手册

TMPN3150B1AFG

TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

TMPN3150B1AFG

Neuron ^®Chip

For Distributed Intelligent Control Networks (L

)

ON ORKS

The TMPN3150B1AFG is a Neuron Chip which configures

nodes in combination with external memory.

ON ORKS

Neuron Chips have all the built-in communications and control

functions required to implement L nodes. These nodes

ON ORKS

may then be easily integrated into highly-reliable distributed

intelligent control networks.

The typical functions for this chip are explained below.

FEATURES

ꢀ I / O Functions

• Eleven programmable I / O pins.

• Two programmable 16-bit timers and counters built in.

QFP64-P-1414-0.80C

• 34 different types of I / O functions to handle a wide range of

input and output.

Weight : 1.0g (Typ.)

• ROM firmware image containing pre-programmed I / O

drivers, greatly simplifying application programs.

( Stored in external ROM )

ꢀ Network functions

• Two CPUs for communication protocol processing built in.

The communications and application CPUs execute in parallel.

• Equipped with a built-in LonTalk protocol which supports all seven levels of the OSI reference model with

ISO.

• Highly reliable communication protocol is supplied as firmware.

• Built-in twisted-pair wire transceiver

• Equipped with communications modes and communication speeds which support various types of external

transceivers.

Supports twisted-pair wire, power line, radio ( RF ), infrared, coaxial cables and fiber optics.

• Communication port transceiver modes and logical addresses stored within the EEPROM.

Can be amended via the network.

000707EBA1

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general

can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the

buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and

to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or

damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the

most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling

Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..

• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal

equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are

neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or

failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy

control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control

instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document

shall be made at the customer’s own risk.

• The products described in this document are subject to the foreign exchange and foreign trade laws.

• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by

TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its

use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or

others.

• The information contained herein is subject to change without notice.

2003-05-26 1/10

12 3 4 5 6 7...10

中文翻译

下载PDF

与TMPN3150B1AFG相关器件

型号	品牌	获取价格	描述	数据表
TMPN3150B1AFG(BR,D)	TOSHIBA	获取价格	IC 5 CHANNEL(S), LOCAL AREA NETWORK CONTROLLER, PQFP64, 14 X 14 MM, 0.80 MM PITCH, LEAD FR
TMPN3150B1F	TOSHIBA	获取价格	TMPN3150B1F
TMPP	MERITEK	获取价格	Metallized Polypropylene Film Capacitors
TMPP/FMPP	MERITEK	获取价格	TMPP/FMPP Series \| Polypropylene Metallized Axial Leaded
TMPP103J2D	MERITEK	获取价格	Metallized Polypropylene Film Capacitors
TMPP103J2G	MERITEK	获取价格	Metallized Polypropylene Film Capacitors
TMPP103J2J	MERITEK	获取价格	Metallized Polypropylene Film Capacitors
TMPP103K2D	MERITEK	获取价格	Metallized Polypropylene Film Capacitors
TMPP103K2G	MERITEK	获取价格	Metallized Polypropylene Film Capacitors
TMPP103K2J	MERITEK	获取价格	Metallized Polypropylene Film Capacitors

与TMPN3150B1AFG相关文章

解析光耦仿真器：升级光耦合器技术的必要性
2024-11-18

18
英伟达新一代Blackwell GPU过热问题致交付延迟
2024-11-18

12
国产厂商思特威CMOS图像传感器芯片单月出货超1亿颗，技术创新引领行业发展
2024-11-14

43
台积电5nm和3nm产能利用率达100%，半导体行业景气度持续攀升
2024-11-14

38

产品中心

服务支持

精选活动

关于我们

帮助中心

TMPN3150B1AFG

TMPN3150B1AFG 技术参数

TMPN3150B1AFG 数据手册

与TMPN3150B1AFG相关器件

与TMPN3150B1AFG相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

TMPN3150B1AFG

TMPN3150B1AFG 技术参数

TMPN3150B1AFG 数据手册

与TMPN3150B1AFG相关器件

与TMPN3150B1AFG相关文章

您还可以找

您在本页遇到什么问题？