Datasheet > TMP93CS42AF

TMP93CS42AF

更新时间： 2024-02-03 20:44:55

品牌	Logo	应用领域
东芝 - TOSHIBA		/
页数	文件大小	规格书
48页	385K
描述
Quality And Reliability Assurance / Handling Precautions

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TMP93CS42AF 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
零件包装代码：	QFP	包装说明：	FQFP, QFP100,.63SQ,20
针数：	100	Reach Compliance Code：	unknown
HTS代码：	8542.31.00.01	风险等级：	5.92
具有ADC：	YES	地址总线宽度：	24
位大小：	16	CPU系列：	TLCS-900/L
最大时钟频率：	20 MHz	DAC 通道：	NO
DMA 通道：	YES	外部数据总线宽度：	16
JESD-30 代码：	S-PQFP-G100	长度：	14 mm
I/O 线路数量：	80	端子数量：	100
最高工作温度：	85 °C	最低工作温度：	-40 °C
PWM 通道：	YES	封装主体材料：	PLASTIC/EPOXY
封装代码：	FQFP	封装等效代码：	QFP100,.63SQ,20
封装形状：	SQUARE	封装形式：	FLATPACK, FINE PITCH
峰值回流温度（摄氏度）：	NOT SPECIFIED	电源：	5 V
认证状态：	Not Qualified	RAM（字节）：	2048
ROM（单词）：	32768	ROM可编程性：	MROM
座面最大高度：	3 mm	速度：	20 MHz
子类别：	Microcontrollers	最大压摆率：	30 mA
最大供电电压：	5.5 V	最小供电电压：	4.5 V
标称供电电压：	5 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子形式：	GULL WING	端子节距：	0.5 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	14 mm	uPs/uCs/外围集成电路类型：	MICROCONTROLLER
Base Number Matches：	1

TMP93CS42AF 数据手册

Quality and Reliability Assurance / Handling Precautions

Quality And Reliability Assurance / Handling Precautions

In recent years, technical revolutions have become almost a daily occurrence in the

electronics industry. This is accompanied by the increasing application of semiconductors in

both the consumer and industrial sectors, and demands for higher quality and higher

reliability.

Toshiba is making every effort to improve both quality and reliability with the following

quality control system which incorporates product design, quality assurance for parts and

materials received, manufacturing process quality assurance, shipping quality and

reliability assurance, and quality after-service based on user demands and market survey

data.

1 Quality And Reliability Assurance

1.1 Quality Assurance

Trying to sense the customer’s needs, we do our best to incorporate the quality and

reliability required by the customer into the design, while considering the safety

and PL (Product Liability) of the products.

Quality and reliability evaluation are performed on the developed products

according to the Toshiba’s reliability test standard which is prepared in conformity

with JIS, EIAJ, MIL, etc., thereby certifying the design. The parts and materials

are standardized through the engineering department and the quality assurance

department. After the design is accepted, standardization is performed by the

engineering department on the parts and materials, process plan, and inspection

plan. Engineering Institution of Works (EW) is then established on the working

detail. The quality and reliability evaluation are performed on the mass-produced

products on an experimental basis.

In the mass production, the production department has control of the

manufacturing process, the environment and facility, and the quality assurance

department. Quality assurance performs incoming inspection of parts and

materials, modification control, instrument control, periodical reliability test and

line audit. The production technology divisions also participate in process

improvement, automatization, etc.

Education and training for quality and reliability, are given to new workers,

inspectors, engineers and small groups (QC/ZD movement). In shipping the

finished products, a lot quality assurance test is performed by the quality assurance

department. We then commence preparation of specifications meeting pre-arranged

quality and reliability standards and the inspection and reports on discrepant

products “quick action” as the motto. Figure 1 shows the quality assurance system

of semiconductor.

030901

QUA-1

2002-02-20

12 3 4 5 6 7...48

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