Datasheet > TMCP1E474TRF

TMCP1E474TRF

更新时间： 2022-02-26 08:51:22

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
12页	243K
描述
Solid Tantalum Surface Mount Chip Capacitors

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TMCP1E474TRF 数据手册

Molded Guide

Vishay Polytech

www.vishay.com

SOLID ELECTROLYTE TANTALUM CAPACITORS

TANTALUM CAPACITORS FOR ALL DESIGN

CONSIDERATIONS

Solid electrolyte designs are the least expensive for a given

rating and are used in many applications where their very

small size for a given unit of capacitance is of importance.

Also important are their good low temperature performance

characteristics and freedom from corrosive electrolytes.

Solid electrolyte capacitors contain manganese dioxide,

which is formed on the tantalum pentoxide dielectric layer

by impregnating the pellet with a solution of manganous

nitrate. The pellet is then heated in an oven, and the

manganous nitrate is converted to manganese dioxide.

The pellet is next coated with graphite, followed by a layer

of metallic silver, which provides a conductive surface

between the pellet and the leadframe.

Datasheets covering the various types and styles of

capacitors for consumer and entertainment electronics and

industry applications are available where detailed

performance characteristics must be specified.

Molded chip tantalum capacitor encases the element in

plastic resins, such as epoxy materials. After assembly, the

capacitors are tested and inspected to assure long life and

reliability. It offers excellent reliability and high stability for

consumer and commercial electronics with the added

feature of low cost.

Surface mount designs of “Solid Tantalum” capacitors use

lead frames as shown in the accompanying drawings.

MOLDED CHIP CAPACITOR, ALL TYPES EXCEPT TMCTX / TMCJ / NMC

Tantalum wire

Supporter

Epoxy encapsulation

Silver adhesive

Leadframe

Solderable cathode termination

Solderable anode termination

Carbon / silver coating

MnO₂

Sintered tantalum

MOLDED CHIP CAPACITOR WITH BUILT-IN FUSE, TYPE TMCTX

Supporter

Tantalum wire

Sintered tantalum

Carbon / silver coating

Epoxy encapsulation

Fusible ribbon

Leadframe

Solderable cathode termination

Solderable anode termination

MnO₂

Silver adhesive

MOLDED CHIP CAPACITOR 0603 SIZE, TYPE TMCJ

Silver adhesive

Tantalum wire

Epoxy encapsulation

Leadframe

Solderable anode termination

Solderable cathode termination

Carbon / silver coating

MnO₂

Sintered tantalum

Revision: 11-Apr-16

Document Number: 40218

For technical questions, contact: tantalum@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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