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TLV7211IDCKRG4

更新时间: 2024-11-23 03:59:19
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16页 470K
描述
CMOS COMPARATORS WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT

TLV7211IDCKRG4 数据手册

 浏览型号TLV7211IDCKRG4的Datasheet PDF文件第2页浏览型号TLV7211IDCKRG4的Datasheet PDF文件第3页浏览型号TLV7211IDCKRG4的Datasheet PDF文件第4页浏览型号TLV7211IDCKRG4的Datasheet PDF文件第5页浏览型号TLV7211IDCKRG4的Datasheet PDF文件第6页浏览型号TLV7211IDCKRG4的Datasheet PDF文件第7页 
TLV7211, TLV7211A  
CMOS COMPARATORS  
WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT  
www.ti.com  
SLCS149BAUGUST 2006REVISED JANUARY 2007  
FEATURES  
APPLICATIONS  
Battery-Powered Products  
Notebooks and PDAs  
Parameters Specified at 2.7-V, 5-V, and 15-V  
Supplies  
Mobile Communications  
Alarm and Security Circuits  
Direct Sensor Interface  
Replaces Amplifiers Used as Comparators  
With Better Performance and Lower Current  
Supply Current 7 µA (Typ) at 5 V  
Response Time 4 µs (Typ) at 5 V  
Push-Pull Output  
Input Common-Mode Range Beyond  
VCC– and VCC+  
Low Input Current  
D PACKAGE  
(TOP VIEW)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
NC  
IN–  
IN+  
VCC–  
OUT  
VCC+  
IN+  
OUT  
VCC+  
IN+  
1
2
3
8
7
6
5
1
2
3
5
4
1
2
3
6
5
4
NC  
VCC–  
IN–  
NC  
VCC–  
VCC+  
OUT  
NC  
IN–  
4
NC – No internal connection  
DESCRIPTION/ORDERING INFORMATION  
The TLV7211 and TLV7211A are micropower CMOS comparators available in the space-saving SOT-23-5  
package. This makes the comparators ideal for space- and weight-critical designs. The TLV7211A features an  
input offset voltage of 5 mV, and the TLV7211 features an input offset voltage of 15 mV.  
The main benefits of the SOT-23-5 package are most apparent in small portable electronic devices, such as  
mobile phones, pagers, notebook computers, personal digital assistants, and PCMCIA cards. The rail-to-rail  
input voltage makes the TLV7211 or TLV7211A a good choice for sensor interfacing, such as light detector  
circuits, optical and magnetic sensors, and alarm and status circuits.  
The SOT-23-5 package's small size allows it to fit into tight spaces on PC boards.  
ORDERING INFORMATION  
VOS  
(MAX)  
TA  
PACKAGE(1)  
SOIC – D  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
Reel of 2500  
Tube of 75  
TLV7211AIDR  
TLV7211AID  
7211AI  
YBN_  
Y8_  
5 mV  
SOT-23-5 – DBV  
Reel of 3000  
Reel of 3000  
Reel of 250  
Reel of 2500  
Tube of 75  
TLV7211AIDBVR  
TLV7211AIDCKR  
TLV7211AIDCKT  
TLV7211IDR  
SOT (SC-70) – DCK  
–40°C to 85°C  
SOIC – D  
TY7211  
YBK_  
Y7_  
TLV7211ID  
15 mV  
SOT-23-5 – DBV  
SOT (SC-70) – DCK  
Reel of 3000  
Reel of 3000  
Reel of 250  
TLV7211IDBVR  
TLV7211IDCKR  
TLV7211IDCKT  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

TLV7211IDCKRG4 替代型号

型号 品牌 替代类型 描述 数据表
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