TLV7211, TLV7211A
CMOS COMPARATORS
WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
www.ti.com
SLCS149B–AUGUST 2006–REVISED JANUARY 2007
FEATURES
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Products
Notebooks and PDAs
•
Parameters Specified at 2.7-V, 5-V, and 15-V
Supplies
Mobile Communications
Alarm and Security Circuits
Direct Sensor Interface
Replaces Amplifiers Used as Comparators
With Better Performance and Lower Current
•
•
•
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Supply Current 7 µA (Typ) at 5 V
Response Time 4 µs (Typ) at 5 V
Push-Pull Output
Input Common-Mode Range Beyond
VCC– and VCC+
•
Low Input Current
D PACKAGE
(TOP VIEW)
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
NC
IN–
IN+
VCC–
OUT
VCC+
IN+
OUT
VCC+
IN+
1
2
3
8
7
6
5
1
2
3
5
4
1
2
3
6
5
4
NC
VCC–
IN–
NC
VCC–
VCC+
OUT
NC
IN–
4
NC – No internal connection
DESCRIPTION/ORDERING INFORMATION
The TLV7211 and TLV7211A are micropower CMOS comparators available in the space-saving SOT-23-5
package. This makes the comparators ideal for space- and weight-critical designs. The TLV7211A features an
input offset voltage of 5 mV, and the TLV7211 features an input offset voltage of 15 mV.
The main benefits of the SOT-23-5 package are most apparent in small portable electronic devices, such as
mobile phones, pagers, notebook computers, personal digital assistants, and PCMCIA cards. The rail-to-rail
input voltage makes the TLV7211 or TLV7211A a good choice for sensor interfacing, such as light detector
circuits, optical and magnetic sensors, and alarm and status circuits.
The SOT-23-5 package's small size allows it to fit into tight spaces on PC boards.
ORDERING INFORMATION
VOS
(MAX)
TA
PACKAGE(1)
SOIC – D
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
Reel of 2500
Tube of 75
TLV7211AIDR
TLV7211AID
7211AI
YBN_
Y8_
5 mV
SOT-23-5 – DBV
Reel of 3000
Reel of 3000
Reel of 250
Reel of 2500
Tube of 75
TLV7211AIDBVR
TLV7211AIDCKR
TLV7211AIDCKT
TLV7211IDR
SOT (SC-70) – DCK
–40°C to 85°C
SOIC – D
TY7211
YBK_
Y7_
TLV7211ID
15 mV
SOT-23-5 – DBV
SOT (SC-70) – DCK
Reel of 3000
Reel of 3000
Reel of 250
TLV7211IDBVR
TLV7211IDCKR
TLV7211IDCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.