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TLV2731IDBVTG4 PDF预览

TLV2731IDBVTG4

更新时间： 2024-11-26 12:15:51
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德州仪器 - TI /
页数 文件大小 规格书
31页 793K
描述
Advanced LinCMOS RAIL-TO-RAIL

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TLV2731IDBVTG4 数据手册

 浏览型号TLV2731IDBVTG4的Datasheet PDF文件第2页浏览型号TLV2731IDBVTG4的Datasheet PDF文件第3页浏览型号TLV2731IDBVTG4的Datasheet PDF文件第4页浏览型号TLV2731IDBVTG4的Datasheet PDF文件第5页浏览型号TLV2731IDBVTG4的Datasheet PDF文件第6页浏览型号TLV2731IDBVTG4的Datasheet PDF文件第7页 
TLV2731, TLV2731Y  
Advanced LinCMOS RAIL-TO-RAIL  
LOW-POWER SINGLE OPERATIONAL AMPLIFIERS  
SLOS198A – AUGUST 1997 – REVISED MARCH 2001  
DBV PACKAGE  
(TOP VIEW)  
Output Swing Includes Both Supply Rails  
Low Noise . . . 15 nV/√Hz Typ at f = 1 kHz  
Low Input Bias Current . . . 1 pA Typ  
OUT  
1
2
3
5
4
V
DD–  
/GND  
Fully Specified for Single-Supply 3-V and  
5-V Operation  
V
DD+  
Common-Mode Input Voltage Range  
Includes Negative Rail  
IN+  
IN–  
High Gain Bandwidth . . . 2 MHz at  
V
= 5 V with 600 Ω Load  
DD  
High Slew Rate . . . 1.6 V/µs at V  
= 5 V  
DD  
Wide Supply Voltage Range  
2.7 V to 10 V  
Macromodel Included  
description  
The TLV2731 is a single low-voltage operational amplifier available in the SOT-23 package. It offers 2 MHz of  
bandwidth and 1.6 V/µs of slew rate for applications requiring good ac performance. The device exhibits  
rail-to-rail output performance for increased dynamic range in single or split supply applications. The TLV2731  
is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.  
The TLV2731, exhibiting high input impedance and low noise, is excellent for small-signal conditioning of  
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels  
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing  
applications. In addition, the rail-to-rail output feature with single- or split-supplies makes this family a great  
choice when interfacing with analog-to-digital converters (ADCs). The device can also drive 600-Ω loads for  
telecom applications.  
2
With a total area of 5.6mm , the SOT-23 package only requires one-third the board space of the standard 8-pin  
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal  
source, minimizing noise pick-up from long PCB traces.  
AVAILABLE OPTIONS  
CHIP  
FORM  
(Y)  
PACKAGED DEVICES  
‡
T
A
V
IO  
max AT 25°C  
SYMBOL  
†
SOT-23 (DBV)  
0°C to 70°C  
3 mV  
3 mV  
TLV2731CDBV  
TLV2731IDBV  
VALC  
VALI  
TLV2731Y  
–40°C to 85°C  
†
‡
The DBV package available in tape and reel only.  
Chip forms are tested at T = 25°C only.  
A
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Advanced LinCMOS is a trademark of Texas Instruments.  
Copyright 2001, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...31

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TLV2731IDBVTG4 替代型号

型号 品牌 替代类型 描述 数据表
TLV2731IDBVR TI

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