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TLV2393Y

更新时间： 2024-11-22 22:37:11
品牌 Logo 应用领域
德州仪器 - TI 比较器放大器放大器电路
页数 文件大小 规格书
16页 255K
描述
DUAL DIFFERENTIAL COMPARATORS

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中文翻译

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TLV2393Y 技术参数

生命周期：Obsolete零件包装代码：DIE
包装说明：DIE-8针数：8
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.76
Is Samacsys：N放大器类型：COMPARATOR
最大平均偏置电流 (IIB)：0.25 µA最大输入失调电压：5000 µV
JESD-30 代码：R-XUUC-N8功能数量：2
端子数量：8最高工作温度：105 °C
最低工作温度：-40 °C输出类型：OPEN-COLLECTOR
封装主体材料：UNSPECIFIED封装代码：DIE
封装形状：RECTANGULAR封装形式：UNCASED CHIP
认证状态：Not Qualified标称响应时间：400 ns
最大压摆率：1.5 mA供电电压上限：7 V
标称供电电压 (Vsup)：5 V表面贴装：YES
技术：BIPOLAR温度等级：INDUSTRIAL
端子形式：NO LEAD端子位置：UPPER
Base Number Matches：1

TLV2393Y 数据手册

 浏览型号TLV2393Y的Datasheet PDF文件第2页浏览型号TLV2393Y的Datasheet PDF文件第3页浏览型号TLV2393Y的Datasheet PDF文件第4页浏览型号TLV2393Y的Datasheet PDF文件第5页浏览型号TLV2393Y的Datasheet PDF文件第6页浏览型号TLV2393Y的Datasheet PDF文件第7页 
TLV1393, TLV1393Y, TLV2393, TLV2393Y  
DUAL DIFFERENTIAL COMPARATORS  
SLCS121A – AUGUST 1993 – REVISED APRIL 1994  
D, P, OR PW PACKAGE  
(TOP VIEW)  
Low-Voltage and Single-Supply Operation  
= 2 V to 7 V  
V
CC  
Common-Mode Voltage Range Includes  
Ground  
1OUT  
1IN–  
1IN+  
GND  
V
CC  
1
2
3
4
8
7
6
5
2OUT  
2IN–  
2IN+  
Fast Response Time  
450 ns Typ (TLV2393)  
Low Supply Current  
0.16 mA Typ (TLV1393)  
Fully Specified at 3-V and 5-V Supply  
Voltages  
description  
The TLV1393 and the TLV2393 are dual differential comparators built using a new Texas Instruments  
low-voltage, high-speed bipolar process. These devices have been specifically developed for low-voltage,  
single-supply applications. Their enhanced performance makes them excellent replacements for the LM393 in  
today’s improved 3-V and 5-V system designs.  
The TLV1393, with its typical supply current of only 0.16 mA, is ideal for low-power systems. Response time  
has also been improved to 0.7 µs. For higher-speed applications, the TLV2393 features excellent ac  
performance with a response time of just 0.45 µs, three times that of the LM393.  
Package availability for these devices includes the TSSOP (thin-shrink small-outline package). With a  
maximum thickness of 1.1 mm and a package area that is 25% smaller than the standard surface-mount  
package, the TSSOP is ideal for high-density circuits, particularly in hand-held and portable equipment.  
AVAILABLE OPTIONS  
PACKAGED DEVICES  
CHIP FORM  
T
A
SUPPLY CURRENT  
(TYP)  
RESPONSE TIME  
(TYP)  
SMALL OUTLINE PLASTIC DIP  
TSSOP  
(Y)  
†
(D)  
(P)  
(PW)  
0.16 mA  
1.1 mA  
0.7 µs  
0.45 µs  
TLV1393ID  
TLV2393ID  
TLV1393IP  
TLV2393IP  
TLV1393IPWLE  
TLV2393IPWLE  
TLV1393Y  
TLV2393Y  
–40°C to 105°C  
†
The PW packages are only available left-ended taped and reeled (e.g., TLV1393IPWLE).  
symbol (each comparator)  
IN+  
IN–  
OUT  
Copyright 1994, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...16

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