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ꢂꢖ ꢓꢆ ꢁ ꢑ ꢗꢕꢘꢑ ꢗ ꢖꢓ ꢒꢔ ꢙꢚ ꢁ ꢖ ꢑ ꢘꢖꢓ ꢇꢀ ꢔꢑ ꢙꢇꢁ ꢇꢐ ꢘ ꢁꢔ ꢛꢔ ꢖꢓ ꢒ
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SLOS157B − JUNE1996 − REVISED APRIL 2005
DBV PACKAGE
(TOP VIEW)
D
D
D
D
Output Swing Includes Both Supply Rails
Low Noise . . . 19 nV/√Hz Typ at f = 1 kHz
Low Input Bias Current . . . 1 pA Typ
IN+
1
2
3
5
4
V
DD+
Fully Specified for Single-Supply 3-V and
5-V Operation
V
DD−
/GND
IN−
D
Very Low Power . . . 110 µA Typ
Common-Mode Input Voltage Range
Includes Negative Rail
OUT
D
D
D
Wide Supply Voltage Range
2.7 V to 10 V
Macromodel Included
description
The TLV2221 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a
compromise between the ac performance and output drive of the TLV2231 and the micropower TLV2211.
It consumes only 150 µA (max) of supply current and is ideal for battery-powered applications. The device
exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The
TLV2221 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2221, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for
high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels
combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing
applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great
choice when interfacing with analog-to-digital converters (ADCs).
2
With a total area of 5.6mm , the SOT-23 package only requires one third the board space of the standard 8-pin
SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal
source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that
is optimized for board layout (see Figure 1). Both inputs are separated by GND to prevent coupling or leakage
paths. The OUT and IN− terminals are on the same end of the board to provide negative feedback. Finally, gain
setting resistors and decoupling capacitor are easily placed around the package.
1
4
V
I
IN+
V
DD+
V+
C
2
3
GND
V
/GND
DD
R
I
5
IN−
OUT
V
O
R
F
Figure 1. Typical Surface Mount Layout for a Fixed-Gain Noninverting Amplifier
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Advanced LinCMOS is a trademark of Texas Instruments Incorporated.
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Copyright 1997 −2005, Texas Instruments Incorporated
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ꢢ ꢍ ꢣ ꢢꢎ ꢋꢭ ꢟꢞ ꢊ ꢧꢧ ꢥꢊ ꢠ ꢊ ꢡ ꢍ ꢢ ꢍ ꢠ ꢣ ꢨ
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