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TLP191B(TPL,U,C,F) PDF预览

TLP191B(TPL,U,C,F)

更新时间: 2024-01-29 19:34:44
品牌 Logo 应用领域
东芝 - TOSHIBA 光电光电器件二极管光电二极管
页数 文件大小 规格书
4页 154K
描述
Optocoupler DC-IN 1-CH Photovoltaic DC-OUT 4-Pin MFSOP T/R

TLP191B(TPL,U,C,F) 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:MINIFLAT, 11-4C1, 6/4 PIN
Reach Compliance Code:compliantHTS代码:8541.40.80.00
风险等级:1.52配置:SINGLE WITH BUILT-IN RESISTOR
JESD-609代码:e1功能数量:1
最高工作温度:85 °C最低工作温度:-25 °C
光电设备类型:OPTOELECTRONIC DEVICE端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
Base Number Matches:1

TLP191B(TPL,U,C,F) 数据手册

 浏览型号TLP191B(TPL,U,C,F)的Datasheet PDF文件第2页浏览型号TLP191B(TPL,U,C,F)的Datasheet PDF文件第3页浏览型号TLP191B(TPL,U,C,F)的Datasheet PDF文件第4页 
TLP191B  
TOSHIBA Photocoupler GaAAs Ired & Photo-Diode Array  
TLP191B  
Telecommunication  
Unit in mm  
Programmable Controllers  
Mos Gate Driver  
MOS FET Gate Driver  
The TOSHIBA mini flat coupler TLP191B is a small outline coupler,  
suitable for surface mount assembly.  
The TLP191B consists of a GaAAs light emitting diode, optically  
coupled to a series connected photo diode array with shunt resistor  
which is suitable for MOS FET gate drive.  
Open voltage: 7.0V(min.)  
Short current: 24.0 μA (min.)  
Isolation voltage: 2500 Vrms (min.)  
UL recognized: UL1577,file no.E67349  
Absolute Maximum Ratings (Ta = 25°C)  
TOSHIBA  
114C1  
Characteristic  
Symbol  
Rating  
50  
Unit  
mA  
Weight: 0.09 g  
Forward current  
I
F
Forward current  
derating (Ta 25°C)  
ΔI / °C  
F
0.5  
mA / °C  
Pin Configuration(top view)  
LED  
Pulse forward current  
(100μs pulse, 100 pps)  
I
1
A
FP  
6
1
Reverse voltage  
V
3
125  
V
R
Junction temperature  
Forward current  
T
°C  
μA  
V
j
I
50  
FD  
4
3
Detector  
Reverse voltage  
V
10  
RD  
Junction temperature  
T
125  
°C  
°C  
°C  
°C  
j
1 . Anode  
3 . Cathode  
4 . Cathode  
6 . Anode  
Storage temperature range  
Operating temperature range  
Lead soldering temperature (10s)  
Isolation voltage  
T
55~125  
40~80  
260  
stg  
opr  
T
T
sol  
BV  
2500  
Vrms  
S
(AC, 1 min., R.H. 60%)  
(Note)  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
(Note) Device considered a two terminal device: Pins 1 and 3 shorted together and pins 4 and 6 shorted together.  
1
2007-10-01  

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