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TLOE50C(W)

更新时间: 2024-12-01 13:14:47
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TLOE50C(W) 数据手册

 浏览型号TLOE50C(W)的Datasheet PDF文件第2页浏览型号TLOE50C(W)的Datasheet PDF文件第3页 
TLOE50C(F)  
TOSHIBA InGaAP LED  
TLOE50C(F)  
Unit: mm  
Panel Circuit Indicator  
Lead(Pb)-free products (lead: Sn-Ag-Cu)  
3mm package wide viewing angle  
InGaAP  
Emitted color: Orange  
Colored, Transparent lens  
Applications: Various types of information panels, indicators for  
amusement equipment and panel backlighting  
illumination sources.  
Absolute Maximum Ratings (Ta = 25°C)  
CHARACTERISTICS  
SYMBOL  
RATING  
UNIT  
FORWARD CURRENT  
I
50  
4
mA  
V
F
REVERSE VOLTAGE  
V
P
R
D
POWER DISSIPATION  
120  
mW  
°C  
JEDEC  
EIAJ  
-
OPERATING TEMPERATURE  
STORAGE TEMPERATURE  
T
−40~100  
40~120  
opr  
-
T
stg  
°C  
TOSHIBA  
43E1A  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
Weight: 0.14 g(Typ.)  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are  
within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Electrical and Optical Characteristics (Ta = 25°C)  
CHARACTERISTICS  
SYMBOL  
TEST CONDITION  
MIN  
TYP MAX UNIT  
V
F
I =20mA  
F
2.0  
2.4  
50  
V
FORWARD VOLTAGE  
I
V =4V  
R
μA  
REVERSE CURRENT  
R
I
V
I =20mA(Note)  
F
2720  
7000  
(612)  
20  
mcd  
nm  
nm  
nm  
LUMINOUS INTENSITY  
PEAK WAVELENGTH  
λ
I =20mA  
F
P
Δλ  
I =20mA  
F
SPECTRAL LINE HALF WIDTH  
DOMINANT WAVELENGTH  
λ
I =20mA  
F
605  
d
(Note): Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes  
single Luminous Intensity class.  
U:2720-7360mcd, V:4760-12900mcd, W:8500 mcd –  
Precautions  
Please be careful of the following:  
Soldering temperature: 260°C max, soldering time: 3 s max  
(soldering portion of lead: up to 1.6 mm from the body of the device)  
If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress to  
the resin. Soldering should be performed after lead forming.  
This visible LED lamp also emits some IR light.  
If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light.  
1
2007-10-01  

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