TLOE50C(F)
TOSHIBA InGaAℓP LED
TLOE50C(F)
Unit: mm
○Panel Circuit Indicator
•
•
•
•
•
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Lead(Pb)-free products (lead: Sn-Ag-Cu)
3mm package wide viewing angle
InGaAℓP
Emitted color: Orange
Colored, Transparent lens
Applications: Various types of information panels, indicators for
amusement equipment and panel backlighting
illumination sources.
Absolute Maximum Ratings (Ta = 25°C)
CHARACTERISTICS
SYMBOL
RATING
UNIT
FORWARD CURRENT
I
50
4
mA
V
F
REVERSE VOLTAGE
V
P
R
D
POWER DISSIPATION
120
mW
°C
JEDEC
EIAJ
-
OPERATING TEMPERATURE
STORAGE TEMPERATURE
T
−40~100
−40~120
opr
-
T
stg
°C
TOSHIBA
4−3E1A
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
Weight: 0.14 g(Typ.)
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are
within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics (Ta = 25°C)
CHARACTERISTICS
SYMBOL
TEST CONDITION
MIN
TYP MAX UNIT
V
F
I =20mA
F
⎯
⎯
2.0
⎯
2.4
50
⎯
⎯
⎯
⎯
V
FORWARD VOLTAGE
I
V =4V
R
μA
REVERSE CURRENT
R
I
V
I =20mA(Note)
F
2720
⎯
7000
(612)
20
mcd
nm
nm
nm
LUMINOUS INTENSITY
PEAK WAVELENGTH
λ
I =20mA
F
P
Δλ
I =20mA
F
⎯
SPECTRAL LINE HALF WIDTH
DOMINANT WAVELENGTH
λ
I =20mA
F
⎯
605
d
(Note): Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes
single Luminous Intensity class.
U:2720-7360mcd, V:4760-12900mcd, W:8500 mcd –
Precautions
Please be careful of the following:
Soldering temperature: 260°C max, soldering time: 3 s max
(soldering portion of lead: up to 1.6 mm from the body of the device)
If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress to
the resin. Soldering should be performed after lead forming.
• This visible LED lamp also emits some IR light.
If a photo detector is located near the LED lamp, please ensure that it will not be affected by this IR light.
1
2007-10-01