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TLC27M2AIPE4 PDF预览

TLC27M2AIPE4

更新时间: 2024-11-23 12:15:47
品牌 Logo 应用领域
德州仪器 - TI 运算放大器光电二极管
页数 文件大小 规格书
50页 1503K
描述
LinCMOS PRECISION DUAL OPERATIONAL AMPLIFIERS

TLC27M2AIPE4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:DIP
包装说明:DIP, DIP8,.3针数:8
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.66
放大器类型:OPERATIONAL AMPLIFIER架构:VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB):0.002 µA最小共模抑制比:65 dB
标称共模抑制比:91 dB频率补偿:YES
最大输入失调电压:7000 µVJESD-30 代码:R-PDIP-T8
JESD-609代码:e4长度:9.81 mm
低-偏置:YES低-失调:NO
微功率:YES功能数量:2
端子数量:8最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:DIP封装等效代码:DIP8,.3
封装形状:RECTANGULAR封装形式:IN-LINE
包装方法:TUBE峰值回流温度(摄氏度):NOT SPECIFIED
功率:NO电源:5/10 V
可编程功率:NO认证状态:Not Qualified
座面最大高度:5.08 mm标称压摆率:0.43 V/us
子类别:Operational Amplifier最大压摆率:0.9 mA
供电电压上限:18 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
标称均一增益带宽:525 kHz最小电压增益:25000
宽带:NO宽度:7.62 mm

TLC27M2AIPE4 数据手册

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ꢀ ꢁꢂ ꢃ ꢄ ꢅꢃ ꢆ ꢀ ꢁꢂ ꢃ ꢄ ꢅꢃ ꢇꢆ ꢀ ꢁꢂ ꢃ ꢄ ꢅꢃ ꢈꢆ ꢀꢁ ꢂꢃ ꢄꢅ ꢄ  
ꢍꢎ ꢏꢂꢐꢌ ꢐꢋ ꢑ ꢒꢓꢇ ꢁ ꢋ ꢍꢏꢎ ꢇꢀ ꢐꢋ ꢑꢇꢁ ꢇꢅ ꢍ ꢁꢐ ꢔꢐ ꢏꢎ ꢌ  
SLOS051E − OCTOBER 1987 − REVISED AUGUST 2008  
D
Trimmed Offset Voltage:  
TLC27M7 . . . 500 µV Max at 25°C,  
= 5 V  
D
D
D
D
D
D
D
Low Noise . . . Typically 32 nV/Hz at  
f = 1 kHz  
V
DD  
Low Power . . . Typically 2.1 mW at 25°C,  
D
D
Input Offset Voltage Drift . . . Typically  
0.1 µV/Month, Including the First 30 Days  
Wide Range of Supply Voltages Over  
Specified Temperature Ranges:  
0°C to 70°C . . . 3 V to 16 V  
−40°C to 85°C . . . 4 V to 16 V  
−55°C to 125°C . . . 4 V to 16 V  
Single-Supply Operation  
V
= 5 V  
DD  
Output Voltage Range Includes Negative  
Rail  
12  
High Input impedance . . . 10 Typ  
ESD-Protection Circuitry  
Small-Outline Package Option Also  
Available in Tape and Reel  
D
D
Designed-In Latch-Up Immunity  
Common-Mode Input Voltage Range  
Extends Below the Negative Rail (C-Suffix,  
I-Suffix Types)  
DISTRIBUTION OF TLC27M7  
INPUT OFFSET VOLTAGE  
D, JG, P OR PW PACKAGE  
(TOP VIEW)  
FK PACKAGE  
(TOP VIEW)  
30  
340 Units Tested From 2 Wafer Lots  
1OUT  
1IN −  
1IN +  
GND  
V
CC  
1
2
3
4
8
7
6
5
V
T
= 5 V  
DD  
= 25°C  
25  
20  
2OUT  
2IN −  
2IN +  
A
P Package  
3
2
1
20 19  
18  
NC  
NC  
1IN −  
NC  
4
5
6
7
8
2OUT  
NC  
17  
16  
15  
14  
15  
10  
5
2IN −  
NC  
1IN +  
NC  
9 10 11 12 13  
0
800  
400  
0
400  
800  
NC − No internal connection  
V
IO  
− Input Offset Voltage − µV  
AVAILABLE OPTIONS  
PACKAGE  
V
max  
IO  
T
A
SMALL OUTLINE  
CHIP CARRIER  
(FK)  
CERAMIC DIP  
(JG)  
PLASTIC DIP  
(P)  
TSSOP  
(PW)  
AT 25°C  
(D)  
500 µV  
2 mV  
TLC27M7CD  
TLC27M2BCD  
TLC27M2ACD  
TLC27M2CD  
TLC27M7ID  
TLC27M2BID  
TLC27M2AID  
TLC27M2ID  
TLC27M7MD  
TLC27M2MD  
TLC27M7CP  
TLC27M2BCP  
TLC27M2ACP  
TLC27M2CP  
TLC27M7IP  
0°C to 70°C  
5 mV  
10 mV  
500 µV  
2 mV  
TLC27M2CPW  
TLC27M2BIP  
TLC27M2AIP  
TLC27M2IP  
40°C to 85°C  
55°C to 125°C  
5 mV  
10 mV  
500 µV  
10 mV  
TLC27M2IPW  
TLC27M7MFK  
TLC27M2MFK  
TLC27M7MJG  
TLC27M2MJG  
TLC27M7MP  
TLC27M2MP  
The D and PW package are available taped and reeled. Add R suffix to the device type (e.g.,TLC27M7CDR). For the most current package and  
ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.  
LinCMOS is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.  
ꢀꢞ  
Copyright 1987 − 2008, Texas Instruments Incorporated  
ꢚ ꢞ ꢛ ꢚꢉ ꢊꢨ ꢖꢕ ꢙ ꢡꢡ ꢟꢙ ꢗ ꢙ ꢘ ꢞ ꢚ ꢞ ꢗ ꢛ ꢣ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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