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TLC072QDRQ1 PDF预览

TLC072QDRQ1

更新时间: 2024-11-15 12:22:27
品牌 Logo 应用领域
德州仪器 - TI 运算放大器输出元件驱动
页数 文件大小 规格书
21页 412K
描述
WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE-SUPPLY OPERATIONAL AMPLIFIER

TLC072QDRQ1 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:GREEN, PLASTIC, MS-012AA, SOIC-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:1.77
放大器类型:OPERATIONAL AMPLIFIER架构:VOLTAGE-FEEDBACK
最大平均偏置电流 (IIB):0.0007 µA25C 时的最大偏置电流 (IIB):0.00005 µA
最小共模抑制比:80 dB标称共模抑制比:95 dB
频率补偿:YES最大输入失调电流 (IIO):0.00005 µA
最大输入失调电压:3000 µVJESD-30 代码:R-PDSO-G8
JESD-609代码:e4长度:4.9 mm
低-偏置:YES低-失调:NO
微功率:NO湿度敏感等级:1
功能数量:2端子数量:8
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE包装方法:TR
峰值回流温度(摄氏度):260功率:NO
电源:+-2.25/+-8/4.5/16 V可编程功率:NO
认证状态:Not Qualified筛选级别:AEC-Q100
座面最大高度:1.75 mm最小摆率:9.5 V/us
标称压摆率:16 V/us子类别:Operational Amplifier
最大压摆率:7 mA供电电压上限:17 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:BIMOS温度等级:AUTOMOTIVE
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED标称均一增益带宽:10000 kHz
最小电压增益:100000宽带:NO
宽度:3.9 mmBase Number Matches:1

TLC072QDRQ1 数据手册

 浏览型号TLC072QDRQ1的Datasheet PDF文件第2页浏览型号TLC072QDRQ1的Datasheet PDF文件第3页浏览型号TLC072QDRQ1的Datasheet PDF文件第4页浏览型号TLC072QDRQ1的Datasheet PDF文件第5页浏览型号TLC072QDRQ1的Datasheet PDF文件第6页浏览型号TLC072QDRQ1的Datasheet PDF文件第7页 
TLC072-Q1  
www.ti.com ...................................................................................................................................................................................................... SLOS583JUNE 2008  
WIDE-BANDWIDTH HIGH-OUTPUT-DRIVE SINGLE-SUPPLY OPERATIONAL AMPLIFIER  
1
FEATURES  
TLC072  
D PACKAGE  
(TOP VIEW)  
23  
Qualified for Automotive Applications  
Wide Bandwidth . . . 10 MHz  
High-Output Drive  
1OUT  
1IN−  
1IN+  
GND  
VDD  
1
2
3
4
8
7
6
5
IOH . . . 57 mA at VDD – 1.5 V  
IOL . . . 55 mA at 0.5 V  
2OUT  
2IN−  
2IN+  
High Slew Rate  
SR+ . . . 16 V/µs  
SR– . . . 19 V/µs  
Operational Amplifier  
Wide Supply Range . . . 4.5 V to 16 V  
Supply Current . . . 1.9 mA/Channel  
+
Ultralow Power Shutdown Mode IDD . . . 125  
mA/Channel  
Low Input Noise Voltage . . . 7 nV/Hz  
Input Offset Voltage . . . 60 µV  
Small 8-Pin SOIC Package  
DESCRIPTION/ORDERING INFORMATION  
The first members of TI's new BiMOS general-purpose operational amplifier family are the TLC07x. The BiMOS  
family concept is simple: provide an upgrade path for BiFET users who are moving away from dual-supply to  
single-supply systems and demand higher AC and dc performance. With performance rated from 4.5 V to 16 V  
across commercial (0°C to 70°C) and an extended industrial temperature range (–40°C to 125°C), BiMOS suits a  
wide range of audio, automotive, industrial and instrumentation applications. Familiar features like offset nulling  
pins enable higher levels of performance in a variety of applications.  
Developed in TI's patented LBC3 BiCMOS process, the new BiMOS amplifiers combine a very high input  
impedance low-noise CMOS front end with a high-drive bipolar output stage, thus providing the optimum  
performance features of both. AC performance improvements over the TL07x BiFET predecessors include a  
bandwidth of 10 MHz (an increase of 300%) and voltage noise of 7 nV/Hz (an improvement of 60%). DC  
improvements include a factor of 4 reduction in input offset voltage down to 1.5 mV (maximum) in the standard  
grade, and a power supply rejection improvement of greater than 40 dB to 130 dB. Added to this list of  
impressive features is the ability to drive ±50-mA loads comfortably from an ultrasmall-footprint MSOP  
PowerPAD™ package, which positions the TLC07x as the ideal high-performance general-purpose operational  
amplifier family.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
TC072Q  
–40°C to 125°C  
SOIC – D  
Reel of 2500  
TLC072QDRQ1  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
PowerPAD is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2008, Texas Instruments Incorporated  

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