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TL75LP05 PDF预览

TL75LP05

更新时间: 2024-11-22 12:21:43
品牌 Logo 应用领域
德州仪器 - TI 稳压器
页数 文件大小 规格书
15页 237K
描述
LOW-DROPOUT VOLTAGE REGULATORS

TL75LP05 数据手册

 浏览型号TL75LP05的Datasheet PDF文件第2页浏览型号TL75LP05的Datasheet PDF文件第3页浏览型号TL75LP05的Datasheet PDF文件第4页浏览型号TL75LP05的Datasheet PDF文件第5页浏览型号TL75LP05的Datasheet PDF文件第6页浏览型号TL75LP05的Datasheet PDF文件第7页 
SLVS073A − SEPTEMBER 1992 − REVISED AUGUST 1995  
Very Low-Dropout Voltage . . . Less Than  
PW PACKAGE  
(TOP VIEW)  
400 mV at 300 mA  
Standby Mode Reduces Current to a  
GND/HEAT SINK  
GND/HEAT SINK  
GND/HEAT SINK  
NC  
NC  
NC  
NC  
NC  
NC  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
Maximum of 150 µA  
Output Regulated to Within 2% Over Full  
Temperature Range  
Packaged in Thin Shrink Small-Outline  
NC  
Package  
ENABLE  
NC  
15 OUTPUT  
Only 10-µF Load Capacitor Required to  
14  
13  
12  
11  
OUTPUT  
NC  
Maintain Regulation at I = 300 mA  
O
INPUT  
INPUT  
NC  
description  
INPUT  
NC  
The TL75LPxxQ devices are low-dropout voltage  
regulators specifically targeted for use in portable  
applications. These devices generate fixed output  
voltages at loads of up to 300 mA with only  
400-mV dropout over the full temperature range.  
GND/HEAT SINK − These terminals have an internal  
connection to ground and must be grounded.  
NC − No internal connection  
The PW package is only available in left-end taped  
and reeled (order device TL75LPxxQPWLE).  
Low-dropout voltage regulators are commonly  
used in battery-powered systems such as analog  
and digital cellular phones. The TL75LPxx family  
of regulators feature a TTL/CMOS-compatible  
enable terminal, which can be used to switch the  
device into standby mode. This feature reduces  
power consumption when the instrument is not  
active. Less that 150 µA is required when the unit  
is disabled.  
typical application schematic  
V 2%  
O
INPUT  
OUTPUT  
at 300 mA  
TL75LPxxQ  
GND/  
HEAT SINK  
V
BAT  
C
= 10 µF  
0.1 µF  
O
ENABLE  
2 V  
DISABLE  
ENABLE  
A concern in many new designs is conservation of  
board space and overall reduction in equipment  
size. The thin shrink small-outline package  
(TSSOP) minimizes board area and reduces  
component height. This package has a maximum height of less than 1.1 mm (compared to the 1.75 mm of a  
standard 8-pin SO package) and dimensions of only 6.5 mm by 4.4 mm.  
All low-dropout regulators require an external capacitor at the output to maintain regulation and stability. To  
further reduce board area and cost, the TL75LPxx devices are designed to require a minimum capacitor of only  
10 µF. This is 1/10 the typical value used by many other low-dropout regulators. To simplify the task of choosing  
a suitable capacitor, TI has included in this datasheet a list of recommended capacitors for use with these  
devices.  
The TL75LPxxQ devices are characterized for operation over T = 40°C to 125°C.  
J
AVAILABLE OPTIONS  
PACKAGED DEVICES  
V
O
CHIP FORM  
(Y)  
T
J
TSSOP  
(PW)  
MIN  
TYP  
MAX  
4.75  
4.9  
4.85  
5
4.95  
5.1  
TL75LP48QPWLE  
TL75LP05QPWLE  
TL75LP08QPWLE  
TL75LP10QPWLE  
TL75LP12QPWLE  
TL75LP48Y  
TL75LP05Y  
TL75LP08Y  
TL75LP10Y  
TL75LP12Y  
40°C to 125°C  
7.84  
9.8  
8
8.16  
10.2  
12.24  
10  
12  
11.76  
The PW package is available only in tape and reel. Chip forms are tested at 25°C.  
ꢀꢣ  
Copyright 1995, Texas Instruments Incorporated  
ꢟ ꢣ ꢠ ꢟꢘ ꢙꢬ ꢛꢚ ꢞ ꢦꢦ ꢤꢞ ꢜ ꢞ ꢝ ꢣ ꢟ ꢣ ꢜ ꢠ ꢨ  
3−1  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  

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