是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA24,5X5,20 | 针数: | 24 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 5.72 | Is Samacsys: | N |
其他特性: | ALSO OPERATES AT 2.5V/3.3V SUPPLY | 地址总线宽度: | 3 |
边界扫描: | NO | 最大时钟频率: | 24 MHz |
通信协议: | ASYNC, BIT | 最大数据传输速率: | 0.1875 MBps |
外部数据总线宽度: | 8 | JESD-30 代码: | S-PBGA-B24 |
JESD-609代码: | e1 | 长度: | 3 mm |
低功率模式: | NO | 湿度敏感等级: | 1 |
串行 I/O 数: | 1 | 端子数量: | 24 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装等效代码: | BGA24,5X5,20 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 2.5/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1 mm | 子类别: | Serial IO/Communication Controllers |
最大供电电压: | 5.5 V | 最小供电电压: | 4.5 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 3 mm |
uPs/uCs/外围集成电路类型: | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TL16C552 | TI |
获取价格 |
DUAL ASYCHRONOUS COMMUNICATIONS ELEMENT WITH FIFO | |
TL16C552A | TI |
获取价格 |
DUAL ASYNCHRONOUS COMMUNICATIONS ELEMENT WITH FIFO | |
TL16C552AFK | TI |
获取价格 |
2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, CQCC68, CERAMIC, LLCC-68 | |
TL16C552AFN | TI |
获取价格 |
DUAL ASYNCHRONOUS COMMUNICATIONS ELEMENT WITH FIFO | |
TL16C552AFNG4 | TI |
获取价格 |
DUAL ASYNCHRONOUS COMMUNICATIONS ELEMENT | |
TL16C552AFNR | TI |
获取价格 |
DUAL ASYNCHRONOUS COMMUNICATIONS ELEMENT | |
TL16C552AFNRG4 | TI |
获取价格 |
DUAL ASYNCHRONOUS COMMUNICATIONS ELEMENT | |
TL16C552AHV | TI |
获取价格 |
DUAL ASYNCHRONOUS COMMUNICATIONS ELEMENT WITH FIFO | |
TL16C552AIFN | TI |
获取价格 |
DUAL ASYNCHRONOUS COMMUNICATIONS ELEMENT | |
TL16C552AIFNG4 | TI |
获取价格 |
DUAL ASYNCHRONOUS COMMUNICATIONS ELEMENT |