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TJ72U330UH15% PDF预览

TJ72U330UH15%

更新时间: 2024-11-14 18:31:23
品牌 Logo 应用领域
威世 - VISHAY 大电流电感器测试
页数 文件大小 规格书
8页 137K
描述
General Fixed Inductor, 1 ELEMENT, 331.78 uH, GENERAL PURPOSE INDUCTOR, RADIAL LEADED

TJ72U330UH15% 技术参数

生命周期:ActiveReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8504.50.80.00
风险等级:5.57直流电阻:0.051 Ω
标称电感 (L):331.78 µH电感器应用:HIGH CURRENT INDUCTOR
电感器类型:GENERAL PURPOSE INDUCTORJESD-609代码:e2
功能数量:1端子数量:2
最大额定电流:8.2 A形状/尺寸说明:CYLINDRICAL PACKAGE
屏蔽:NO表面贴装:NO
端子面层:TIN COPPER端子位置:RADIAL
端子形状:WIRE测试频率:0.01 MHz
容差:15%Base Number Matches:1

TJ72U330UH15% 数据手册

 浏览型号TJ72U330UH15%的Datasheet PDF文件第2页浏览型号TJ72U330UH15%的Datasheet PDF文件第3页浏览型号TJ72U330UH15%的Datasheet PDF文件第4页浏览型号TJ72U330UH15%的Datasheet PDF文件第5页浏览型号TJ72U330UH15%的Datasheet PDF文件第6页浏览型号TJ72U330UH15%的Datasheet PDF文件第7页 
TJ  
Vishay Dale  
Inductors  
Toroid, High Current  
FEATURES  
• Printed circuit mounting.  
• Wide range of inductance and current ratings.  
Toroid design reduces EMI.  
• Vertical or horizontal mounting to optimize P.C. Board layout.  
APPLICATIONS  
Switching power supplies, EMI/RFI filtering, output chokes.  
DIMENSIONS in inches [millimeters]  
Vertical Mount  
(Mounting/Coating Code - 1U)  
Horizontal Mount  
(Mounting/Coating Code - 2U)  
Hot Solder Dip  
Part  
Marking  
Leads  
H
Ld  
Part  
Marking  
Ls  
D
0.062**  
[1.58]  
Max.  
D
0.062**  
[1.58]  
Max.  
0.500 [12.7]  
Min.  
H
Ls  
0.500  
[12.7]  
Min.  
Hot Solder Dip  
Ld  
Leads  
NOMINAL  
LEAD  
NOMINAL  
LEAD  
NOMINAL  
NOMINAL  
DIAMETER (D) HEIGHT (H) LEAD SPACING DIAMETER  
DIAMETER (D) HEIGHT (H) LEAD SPACING DIAMETER  
MODEL  
(Max.)  
(Max.)  
(Ls)  
(Ld)  
MODEL  
(Max.)  
(Max.)  
(Ls)  
(Ld)  
TJ3  
0.65  
[16.5]  
0.30  
[7.6]  
0.26 ± 0.04  
[6.60 ± 1.02]  
See TJ3  
Data  
TJ3  
0.66  
[16.8]  
0.32  
[8.1]  
0.58 ± 0.08  
[14.7 ± 2.03]  
See TJ3  
Data  
TJ4  
TJ5  
TJ6  
TJ7  
TJ8  
TJ9  
0.88  
0.40  
0.31 ± 0.09  
See TJ4  
Data  
TJ4  
TJ5  
TJ6  
TJ7  
TJ8  
TJ9  
0.88  
0.40  
0.78 ± 0.10  
See TJ4  
Data  
[22.4]  
[10.2]  
[7.87 ± 2.29]  
[22.4]  
[10.2]  
[19.8 ± 2.54]  
1.00  
[25.4]  
0.45  
[11.4]  
0.37 ± 0.08  
[9.40 ± 2.03]  
See TJ5  
Data  
1.00  
[25.4]  
0.45  
[11.4]  
0.90 ± 0.10  
[22.9 ± 2.54]  
See TJ5  
Data  
1.38  
[35.1]  
0.83  
[21.1]  
0.73 ± 0.10  
[18.5 ± 2.54]  
See TJ6  
Data  
1.38  
[35.1]  
0.83  
[21.1]  
1.22 ± 0.16  
[31.0 ± 4.06]  
See TJ6  
Data  
1.65  
[41.9]  
0.75  
[19.1]  
0.62 ± 0.13  
[15.8 ± 3.30]  
See TJ7  
Data  
1.65  
[41.9]  
0.75  
[19.1]  
1.48 ± 0.17  
[37.6 ± 4.32]  
See TJ7  
Data  
1.92  
[48.8]  
1.00  
[25.4]  
0.82 ± 0.18  
[20.8 ± 4.57]  
See TJ8  
Data  
1.94  
[49.3]  
1.00  
[25.4]  
1.76 ± 0.18  
[44.7 ± 4.57]  
See TJ8  
Data  
2.66  
[67.6]  
1.42  
[36.1]  
1.25 ± 0.17  
[31.8 ± 4.32]  
See TJ9  
Data  
2.72  
[69.1]  
1.42  
[36.1]  
2.49 ± 0.23  
[63.2 ± 5.84]  
See TJ9  
Data  
*On larger units and units with finer wire, additional mechanical mounting is recommended. **Leads stripped to within .062" [1.58mm] of the coil.  
ENVIRONMENTAL PERFORMANCE  
TEST  
CONDITIONS  
SPECIFICATIONS  
Thermal Shock  
Resistance to Soldering Heat  
Solderability  
Test Condition B1  
MIL-STD-202, Method 107  
MIL-STD-202, Method 210  
MIL-STD-202, Method 208  
Document Number 34079  
Revision 16-Nov-04  
For technical questions, contact Magnetics@vishay.com  
www.vishay.com  
49  

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