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TJ5631BGD PDF预览

TJ5631BGD

更新时间: 2024-11-22 00:48:47
品牌 Logo 应用领域
韩国泰进 - HTC /
页数 文件大小 规格书
8页 187K
描述
Dual Channel Fixed Voltage Linear Regulator

TJ5631BGD 数据手册

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Dual Channel Fixed Voltage Linear Regulator  
TJ5631  
FEATURES  
Dual Channel Ultra Low Dropout Voltage  
Compatible with low ESR MLCC as Input/Output Capacitor  
Good Line and Load Regulation  
Guaranteed Output Current of 300/500mA  
Available in SOP8, SOP8-PP  
Fixed Output Voltage: 1 ~ 5V  
SOP8 / SOP8-PP  
Over-Temperature Protection  
-40 ºC to 125 ºC Junction Temperature Range  
APPLICATION  
LCD TVs and SETTOP Boxes  
Battery Powered Equipments  
Motherboards and Graphic Cards  
Microprocessor Power Supplies  
Peripheral Cards  
High Efficiency Linear Regulators  
Battery Chargers  
ORDERING INFORMATION  
Device  
TJ5631AGD  
TJ5631BGD  
TJ5631CGD  
TJ5631DGD  
TJ5631EGD  
TJ5631FGD  
TJ5631HGD  
TJ5631AGDP  
TJ5631BGDP  
TJ5631CGDP  
TJ5631DGDP  
TJ5631EGDP  
TJ5631FGDP  
TJ5631HGDP  
Package  
DESCRIPTION  
SOP8  
The TJ5631 of two channels high performance ultra-low  
dropout linear regulators operates from 2.5V to 5.5V input  
supply and provides ultra-low dropout voltage with low  
ground current. These ultra-low dropout linear regulators  
respond fast to step changes in load which makes them  
suitable for low voltage micro-processor applications. The  
TJ5631 is developed on a CMOS process technology which  
allows low quiescent current operation independent of  
output load current. This CMOS process also allows the  
TJ5631 to operate under extremely low dropout conditions.  
SOP8-PP  
Absolute Maximum Ratings  
CHARACTERISTIC  
Input Supply Voltage (Survival)  
SYMBOL  
MIN.  
MAX.  
UNIT  
VIN1, VIN2  
VEN1, VEN2,  
IMAX  
-
-
-
6.5  
6.5  
V
V
Enable Input Voltage (Survival)  
Maximum Continuous Output Current  
Lead Temperature (Soldering, 5 sec)  
Storage Temperature Range  
300/500  
260  
mA  
ºC  
ºC  
ºC  
TSOL  
TSTG  
-65  
-40  
150  
Operating Junction Temperature Range  
TJOPR  
125  
68  
15  
ΘJA-SOP8-PP  
ΘJC-SOP8-PP  
Package Thermal Resistance *  
ºC/W  
* Calculated from package in still air, mounted to 2.6mm X 3.5mm(minimum foot print) 2 layer PCB without thermal vias per JESD51 standards.  
Apr. 2014 R1.2  
1/8  
HTC  

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