生命周期: | Active | 包装说明: | BGA, |
Reach Compliance Code: | unknown | 风险等级: | 5.77 |
JESD-30 代码: | R-PBGA-B169 | 端子数量: | 169 |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY |
最大供电电压: | 3.6 V | 最小供电电压: | 2.7 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子形式: | BALL |
端子位置: | BOTTOM | uPs/uCs/外围集成电路类型: | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
THGBM5G5A1JBAIR | TOSHIBA | Semiconductor & Storage Products Company |
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THGBM5G5A1JBAIT | TOSHIBA | Flash Card |
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THGBM5G6A2JBAIR | TOSHIBA | Semiconductor & Storage Products Company |
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THGBM5G7A2JBAIM | TOSHIBA | Semiconductor & Storage Products Company |
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|
THGBM5G7B2JBAIM | TOSHIBA | Flash Card |
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|
THGBM5G8A4JBAIM | TOSHIBA | Semiconductor & Storage Products Company |
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