Datasheet > TFLF6755-12.800M

TFLF6755-12.800M

更新时间： 2024-12-01 06:02:27

品牌	Logo	应用领域
CONNOR-WINFIELD		石英晶振温度补偿晶振
页数	文件大小	规格书
2页	184K
描述
SURFACE MOUNT 3.3V HCMOS TCXO

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中文翻译

获取价格

数据手册

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TFLF6755-12.800M 数据手册

THE CONNOR-WINFIELD CORP.

2111 COMPREHENSIVE DRIVE.

AURORA, IL 60505.

FAX (630) 851-5040.

PHONE (630) 851-4722.

www.conwin.com

P R O D UC T D ATA S H E E T

CRYSTAL CONTROLLED OSCILLATORS

SURFACE MOUNT 3.3V HCMOS TCXO

TFLF6755

ABSOLUTE MAXIMUM RATINGS

PARAMETER

TABLE 1.0

NOTE

UNITS

MINIMUM NOMINAL MAXIMUM

UNITS

°C

Storage Temperature

-40

Supply Voltage

(Vcc)

-0.5

5.5

Vdc

DESCRIPTION

OPERATING SPECIFICATIONS

PARAMETER

TABLE 2.0

NOTE

MINIMUM NOMINAL MAXIMUM

UNITS

MHz

ppm

The Connor Winfield TFLF6755

is a Surface Mount Temperature

Compensated Crystal Oscillator

(TCXO). Operating at 3.3Vdc, the

TFLF6755 will maintain ±4.0ppm

frequency tolerance over 20

years. The TFLF6755 is offered

in a surface mount package for

automated assembly.

Frequency Range

(Fo)

12.80

Frequency Accuracy @ 25°C Pre-Relow

Frequency Stability vs. Temperature

Frequency Stability vs. Supply Voltage

Total Frequency Tolerance

Operating Temperature Range

Supply Voltage

-1.5

1.5

-0.28

0.28

ppm

-0.05

0.05

-4.0

4.0

ppm

°C

(Vcc)

(Icc)

3.135

3.3

3.465

Vdc

Supply Current

Jitter (BW=10Hz to 20MHz)

Jitter (BW=12kHz to 20MHz)

SSB Phase Noise at 10Hz offset

SSB Phase Noise at 100Hz offset

SSB Phase Noise at 1KHz offset

SSB Phase Noise at 10KHz offset

SSB Phase Noise at 100KHz offset

ps rms

dBc/Hz

-70

-100

-125

-135

-145

FEATURES

HCMOS OUTPUT CHARACTERISTICS

PARAMETER

TABLE 3.0

NOTE

3.3V OPERATION

MINIMUM NOMINAL MAXIMUM

UNITS

LOAD

2.4

FREQUENCY STABILITY: +/-0.28 PPM

TEMPERATURE RANGE: 0 TO 70C

Voltage

Current

(High)

(Low)

(High)

(Low)

(Voh)

(Vol)

(Ioh)

Vdc

0.4

-4

Duty Cycle at 50% of Vcc

OVERALL FREQUENCY TOLERANCE:

+/-4.0PPM OVER 20 YEARS.

Rise / Fall Time 10% to 90%

LOW JITTER <1PS RMS

PACKAGE CHARACTERISTICS

TABLE 4.0

Package

Non-hermetic package consisting of an FR4 substrate with grounded metal

cover.

SURFACE MOUNT PACKAGE

TAPEAND REEL PACKAGING

PROCESS

RECOMMENDATIONS

Solder Reflow

TABLE 5.0

The component solder used internal to this device has a melting point of

221°C. The peak temperature inside the device should be less than or

equal to 220°C for a maximum of 10 seconds

ORDERING INFORMATION

Wash

Ultrasonic cleaning is not recommended.

Note:

TFLF6755 - 12.800MHz

1) Inclusive of calibration, frequency vs. temperature stability, supply voltage change, load

change, shock and vibration and aging for twenty years.

TCXO

CENTER

FREQUENCY

SERIES

Specifications subject to change without notice.

04/05/05

Tx133

REV:

DATASHEET #:

PAGE

DATE:

中文翻译

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