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TE28F320S3-100 PDF预览

TE28F320S3-100

更新时间: 2024-11-13 22:08:15
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
52页 1261K
描述
WORD-WIDE FlashFile MEMORY FAMILY

TE28F320S3-100 数据手册

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ADVANCE INFORMATION  
E
WORD-WIDE  
FlashFile™ MEMORY FAMILY  
28F160S3, 28F320S3  
Includes Extended Temperature Specifications  
Two 32-Byte Write Buffers  
Cross-Compatible Command Support  
Intel Standard Command Set  
2.7 µs per Byte Effective  
Programming Time  
Common Flash Interface (CFI)  
Scaleable Command Set (SCS)  
Low Voltage Operation  
2.7V or 3.3V VCC  
100,000 Block Erase Cycles  
2.7V, 3.3V or 5V VPP  
Enhanced Data Protection Features  
Absolute Protection with VPP = GND  
Flexible Block Locking  
100 ns Read Access Time (16 Mbit)  
110 ns Read Access Time (32 Mbit)  
Block Erase/Program Lockout  
during Power Transitions  
High-Density Symmetrically-Blocked  
Architecture  
32 64-Kbyte Erase Blocks (16 Mbit)  
64 64-Kbyte Erase Blocks (32 Mbit)  
Configurable x8 or x16 I/O  
Automation Suspend Options  
Program Suspend to Read  
System Performance Enhancements  
STS Status Output  
Block Erase Suspend to Program  
Block Erase Suspend to Read  
Industry-Standard Packaging  
µBGA* package, SSOP, and  
TSOP (16 Mbit)  
ETOX™ V Nonvolatile Flash  
Technology  
µBGA* package and SSOP (32 Mbit)  
Intel’s Word-Wide FlashFile™ memory family provides high-density, low-cost, non-volatile, read/write storage  
solutions for a wide range of applications. The Word-Wide FlashFile memories are available at various  
densities in the same package type. Their symmetrically-blocked architecture, flexible voltage, and extended  
cycling provide highly flexible components suitable for resident flash arrays, SIMMs, and memory cards.  
Enhanced suspend capabilities provide an ideal solution for code or data storage applications. For secure  
code storage applications, such as networking, where code is either directly executed out of flash or  
downloaded to DRAM, the Word-Wide FlashFile memories offer three levels of protection: absolute protection  
with VPP at GND, selective block locking, and program/erase lockout during power transitions. These  
alternatives give designers ultimate control of their code security needs.  
This family of products is manufactured on Intel’s 0.4 µm ETOX™ V process technology. It comes in the  
industry-standard 56-lead SSOP and µBGA packages. In addition, the 16-Mb device is available in the  
industry-standard 56-lead TSOP package.  
June 1997  
Order Number: 290608-001  

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