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TDA9889TS

更新时间： 2024-01-07 19:40:31
品牌 Logo 应用领域
恩智浦 - NXP 放大器
页数 文件大小 规格书
22页 133K
描述
DVB selective AGC amplifier

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中文翻译

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TDA9889TS 技术参数

是否Rohs认证： 不符合生命周期：Transferred
包装说明：SSOP, SSOP16,.3Reach Compliance Code：unknown
风险等级：5.85JESD-30 代码：R-PDSO-G16
JESD-609代码：e0端子数量：16
最高工作温度：70 °C最低工作温度：-20 °C
封装主体材料：PLASTIC/EPOXY封装代码：SSOP
封装等效代码：SSOP16,.3封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, SHRINK PITCH电源：5 V
认证状态：Not Qualified子类别：Other Consumer ICs
最大压摆率：64 mA表面贴装：YES
温度等级：COMMERCIAL端子面层：Tin/Lead (Sn/Pb)
端子形式：GULL WING端子节距：0.635 mm
端子位置：DUAL

TDA9889TS 数据手册

 浏览型号TDA9889TS的Datasheet PDF文件第16页浏览型号TDA9889TS的Datasheet PDF文件第17页浏览型号TDA9889TS的Datasheet PDF文件第18页浏览型号TDA9889TS的Datasheet PDF文件第19页浏览型号TDA9889TS的Datasheet PDF文件第21页浏览型号TDA9889TS的Datasheet PDF文件第22页 
Philips Semiconductors  
Product specification  
DVB selective AGC amplifier  
TDA9888TS; TDA9889TS  
Suitability of surface mount IC packages for wave and reflow soldering methods  
SOLDERING METHOD  
WAVE  
REFLOW(2)  
not suitable suitable  
PACKAGE(1)  
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,  
VFBGA, XSON  
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,  
HTQFP, HTSSOP, HVQFN, HVSON, SMS  
not suitable(4)  
suitable  
PLCC(5), SO, SOJ  
suitable  
suitable  
LQFP, QFP, TQFP  
not recommended(5)(6) suitable  
SSOP, TSSOP, VSO, VSSOP  
CWQCCN..L(8), PMFP(9), WQCCN..L(8)  
not recommended(7)  
suitable  
not suitable  
not suitable  
Notes  
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy  
from your Philips Semiconductors sales office.  
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum  
temperature (with respect to time) and body size of the package, there is a risk that internal or external package  
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the  
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.  
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account  
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature  
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature  
must be kept as low as possible.  
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder  
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,  
the solder might be deposited on the heatsink surface.  
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.  
The package footprint must incorporate solder thieves downstream and at the side corners.  
6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not  
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than  
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted  
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar  
soldering process. The appropriate soldering profile can be provided on request.  
9. Hot bar soldering or manual soldering is suitable for PMFP packages.  
2004 Nov 02  
20  
1...171819202122

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