Philips Semiconductors
Product specification
DVB selective AGC amplifier
TDA9888TS; TDA9889TS
SOLDERING
To overcome these problems the double-wave soldering
method was specifically developed.
Introduction to soldering surface mount packages
If wave soldering is used the following conditions must be
observed for optimal results:
This text gives a very brief insight to a complex
technology. A more in-depth account of soldering ICs can
be found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by
a smooth laminar wave.
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package
placement. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint
must be placed at a 45° angle to the transport direction
of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side
corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 seconds and 200 seconds
depending on heating method.
During placement and before soldering, the package
must be fixed with a droplet of adhesive. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 °C to 270 °C depending on solder paste material.
The top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250 °C or 265 °C, depending
on solder material applied, SnPb or Pb-free respectively.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– for all BGA, HTSSON..T and SSOP..T packages
Manual soldering
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 seconds to 5 seconds
between 270 °C and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit
boards with a high component density, as solder bridging
and non-wetting can present major problems.
2004 Nov 02
19
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