TDA8174AW

更新时间： 2024-02-03 10:25:06

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		消费电路商用集成电路偏转集成电路电视监视器局域网
页数	文件大小	规格书
5页	64K
描述
VERTICAL DEFLECTION CIRCUIT

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技术参数
数据手册

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TDA8174AW 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
包装说明：	ZIP, ZIP11,.1,.1,67	Reach Compliance Code：	compliant
风险等级：	5.85	Is Samacsys：	N
应用：	TV; MONITOR	消隐输出：	NO
商用集成电路类型：	VERTICAL DEFLECTION IC	JESD-30 代码：	R-PSFM-T11
功能数量：	1	端子数量：	11
最高工作温度：	70 °C	最低工作温度：
封装主体材料：	PLASTIC/EPOXY	封装代码：	ZIP
封装等效代码：	ZIP11,.1,.1,67	封装形状：	RECTANGULAR
封装形式：	FLANGE MOUNT	电源：	10/35 V
认证状态：	Not Qualified	子类别：	Deflection ICs
最大供电电压 (Vsup)：	30 V	最小供电电压 (Vsup)：	10 V
表面贴装：	NO	温度等级：	COMMERCIAL
端子形式：	THROUGH-HOLE	端子节距：	1.7 mm
端子位置：	SINGLE	Base Number Matches：	1

TDA8174AW 数据手册

TDA8174A - TDA8174AW

PACKAGE MECHANICAL DATA

11 PINS - PLASTICCLIPWATT

Millimeters

Inches

Dimensions

Min.

Typ.

Max.

3.10

1.10

Min.

Typ.

Max.

0.122

0.04

0.15

1.50

0.006

0.059

0.02

0.03

0.066

0.66

0.48

0.79

0.70

0.57

0.43

0.1

0.52

0.80

1.70

17.00

12.00

20.00

17.90

14.40

11.00

2.54

0.1

Information furnishedis believed to be accurate and reliable.However, SGS-THOMSON Microelectronics assumes no responsibility

for the consequences of use of such information nor for any infringement of patentsor other rights of third parties which may result

from itsuse. No licence is grantedby implication orotherwise underany patent or patent rights of SGS-THOMSON Microelectronics.

Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all

information previouslysupplied. SGS-THOMSON Microelectronics products are not authorized for use as criticalcomponents in life

support devices or systems without express written approval of SGS-THOMSON Microelectronics.

Purchase of I²C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips

I²C Patent. Rights to use these components in a I²C system, is granted provided that the system conforms to

the I²C Standard Specifications as defined by Philips.

SGS-THOMSON Microelectronics GROUP OF COMPANIES

Australia - Brazil - Canada - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco

The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

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